SAN DIEGO – The Electronics, Components and Technology Conference (ECTC), the international packaging conference, will again be virtual this year, running Jun. 1 through Jul. 4.

The conference will include over 350 technical papers organized into 46 topical sessions, where each session will be available as an on-demand webcast for the duration of the conference.

Technical sessions cover all aspects of advanced packaging: wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, interconnections, packaging for high speed and high bandwidth, photonics, flexible and printed electronics.

To learn more about the conference go to the ECTC website and join the ECTC LinkedIn group.

Early registration ends May 14. Visit www.ectc.net for details.

PCB EAST: The original East Coast technical conference and exhibition! Returning to the Boston suburbs in June 2021! 

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