LYON, FRANCE -- “SiP has become synonymous with technologies ranging from high-end die-to-die chiplet-type advanced integration to devices found in mobile handsets with increased integration and functionality leveraging best-in-class advanced packaging processes.”

So says Vaibhav Trivedi, senior technology and market analyst, packaging, at Yole Développement (Yole).

“The SiP platform is crucial inachieving ‘More than Moore’ in the race for heterogeneous integration, where advanced packaging remains at the forefront with front-end technology,” he adds.

The SiP market is expected to increase from $14 billion in 2020 to $19 billion+ in 2026, the research firm says. SiP products includes high- to mid-end SiP devices, such as computing and data center applications, with much higher margins than the low-end SiP devices found in mobile handsets. High-end SiP device sales are expected to grow at a 9% CAGR between 2020 and 2026, whereas low-end RF SiPs, such as those found in mobile phones, are expected to grow at a CAGR of 5%.

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