APOPKA, FL – Northrop Grumman has invested in a wafer post-processing and test line tailored for defense applications, producing advanced packaging assemblies integrated in RF, digital and electro-optic/infrared systems.

The so-called μ-Line offers backend wafer post-processing capabilities, including passivation, solder bumping, dicing, advanced inspection and test for up to 300mm wafers.

“The systems that Northrop Grumman builds need increasingly higher levels of device integration to meet customer performance, reliability and affordability requirements, no matter the domain and conditions where it will be used,” said Scott Crudele, vice president, navigation targeting and survivability operations, Northrop Grumman. “By establishing this new line, we can provide our customers with a trusted packaging source to meet our quality specifications.”

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