BEAVERTON, OR – Advanced Semiconductor Engineering, AMD, Arm, Google Cloud, Intel, Meta, Microsoft, Qualcomm, Samsung and Taiwan Semiconductor Manufacturing formed a consortium to establish a die-to-die interconnect standard and foster an open chiplet ecosystem.

The organization, representing a diverse ecosystem of market segments, will address customer requests for more customizable package-level integration, connecting best-in-class die-to-die interconnect and protocols from an interoperable, multi-vendor ecosystem.

The founding companies ratified the Universal Chiplet Interconnect Express (UCIe) specification, an open industry standard developed to establish a ubiquitous interconnect at the package level, now available for members as a download.

The specification provides a standardized die-to-die interconnect with physical layer, protocol stack, software model and compliance testing to enable end users to mix and match chiplet components from a multi-vendor ecosystem for System-on-Chip (SoC) construction, including customized SoC.

The UCIe 1.0 specification covers the die-to-die I/O physical layer, die-to-die protocols and software stack that leverage the PCI Express (PCIe) and Compute Express Link (CXL) industry standards.

To become a member, contact admin@UCIexpress.org.

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