PEACHTREE CITY, GA – CIRCUITS ASSEMBLY today announced the 2023 New Product Introduction Award winners for electronics assembly equipment, materials and software.

The 16th annual NPI Awards recognize leading new products during the past 12 months. An independent panel of practicing industry engineers selected the recipients.

The winners are:

Scienscope                              Automation Tools (5100c III X-Ray Component Counter)

Surfx Technologies                  Cleaning Equipment (STA-10 Automated Plasma System)

Europlacer                               Component Placement - Accessory Technologies (Freeform Feeder)

ASYS Group                             Component Storage (Reel-Magazine)

ITW EAE                                    Dispensing Equipment (ITW Camalot Prodigy Advanced Tilt and Rotate)

Selectech                                ESD (SelecTile ESD Interlocking Flooring)

Aven Tools                               First Article Inspection (Mighty Vue Inspector)

Koh Young                               Process Control Tools (Neptune C)

ASMPT                                      Screen and Stencil Printing (DEK TQ L Printing Platform)

Stentech                                  Screen/Stencil Printing Peripherals/Consumables (Advanced Nano Stencil Coating)

Koh Young                              Software – Process Control (KPO Printer Software)

ASYS Group                            Software – Production (Extended ASYCAM Software)

Smartsol                                  Soldering – Alternative (SMarTsol Soldering Robots)

Weller Tools                            Soldering – Hand Tool (s (WXair Rework Module)

ECD                                        Soldering – Process Control (MOLE EV6 Thermal Profiler)

SASinno Americas                Soldering – Selective (Unit-i1 Selective Soldering Machine)

ITW EAE                                  Soldering – Wave (Auto Exit Wing)

Indium                                   Cored Wire (CW-818 Fast Wetting, No-Clean Cored Wire)

Shenmao                              Solder Paste (PF918-PW216 Solder Paste)

Saki Corp.                             Test and Inspection – AOI (3Di Series)

Magnalytix                           Test and Inspection – Functional Test (OE-300)

Henkel                                   Thermal Interface Materials (Bergquist Liqui Form TLF 10000)

The awards were presented during a ceremony in San Diego, concurrent with the IPC Apex Expo trade show.

“Printed circuit assemblies are getting smaller and tighter,” said Mike Buetow, president of the Printed Circuit Engineering Association. “The judges this year focused on tools with the flexibility and accuracy needed to support this ongoing trend.”

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