MILPITAS, CA – Global semiconductor equipment billings contracted 11% year-over-year to $25.6 billion in the third quarter, while quarter-over-quarter billings slipped 1% during the same period, SEMI announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report.

“The Q3 2023 dip in equipment billings was due to softening chip demand,” said Ajit Manocha, SEMI President and CEO. “However, China has shown strong demand and spending power for mature-node technologies, a sign of the industry's resilience and growth potential in the long run.”

Compiled from data submitted by members of SEMI and the Semiconductor Equipment Association of Japan (SEAJ), the WWSEMS Report is a summary of the monthly billings figures for the global semiconductor equipment industry.

Following are quarterly billings data in billions of U.S. dollars with quarter-over-quarter and year-over-year changes by region:

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