LOVELAND, CO – Kerafol and X2F are partnering to develop thermal management solutions for electronic devices using Kerafol's thermally conductive materials and X2F's controlled-viscosity molding technologies.

The partnership aims to provide advanced thermal management solutions that meet the ever-increasing high-performance demands of the electronics industry, the companies said in a release.

Combining Kerafol’s high-performance thermoplastic elastomeric materials with X2F’s controlled- viscosity molding (CVM) technology delivers a higher-performance alternative to conformal coating, potting, and sealing of electronics, achieving superior environmental protection and heat dissipation while reducing processing times and manufacturing costs, the companies said.

The companies aim to create a strategic partnership to deliver advanced protection for electronic devices, ensuring long-term reliability by safeguarding against contamination, vibration, shock, ESD, and thermal stresses, all in a streamlined, one-step process.

Kerafol’s silicone-free Keramold materials are soft and flexible, highly electrically isolating, thermally conductive and can be molded into complex geometric shapes, making them ideal for overmolding electronics. Additionally, Keramold materials are easy to handle, process at room temperature and require no refrigeration, drying, pre-treatment or post cure.

The X2F CVM approach to overmolding electronics combines patented hardware, sensors, and software to control the viscosity of ultra-high-performance materials and optimize mold pressure. Heat is generated electrically for continuous temperature control, and a multi-step “pulse-pack” extrusion process is used to fill the mold. By continuously sensing mold cavity pressure and deploying its “pack- hold-and-repack” process, X2F builds to the best mold pressure for the application. As a result, X2F can mold ultra-high-performance materials and complex geometries that were previously considered unmoldable.

"Our Keramold thermoplastic elastomers flow extremely well on X2F’s CVM equipment, wrapping the complex contours of components and PCBs. And because of its softness, when pressure is applied it conforms to surfaces unlike any other material in the industry, without damaging sensitive components," said Wolfgang Hoefer, Thermal Products Division manager at Kerafol.

"We are excited about this collaboration because it provides our customers a new approach for heat management in electronics that is far superior to conformal coating and potting in many applications," said X2F CEO Mike Slowik.

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