BOSTON – SMTA's Boston chapter will meet in person on June 25, with two presentations set for attendees: "The Impact of Ultra HDI Fabrication Technology on PCB Assembly" presented by Chrys Shea, and "SMT Specification Performance in PCB Assembly" presented by Mike Sivigny.

The meeting will take place from 5-9:30 p.m. at New England Die Cutting, 96 Milk St., Methuen, MA 01844.

"The Impact of Ultra HDI Fabrication Technology on PCB Assembly" presented by Chrys Shea of Shea Engineering

Technical Presentation Overview: The migration of circuitry to Ultra HDI brings many benefits in terms of miniaturization. The fabrication technology is undergoing a step-function change in densities – and therefore functionalities – that will enable an entire new generation of electronics for defense, healthcare, transportation and communications.

The fact that a printed circuit board can be fabricated does not necessarily indicate it can also be assembled. For high-performance products, very little reliability data exists for high reliability UHDI assemblies.

The newly released SMTA Ultra HDI Assembly Test Board brings special attention in terms of validating new processes needed with this miniaturization and testing the reliability of their outputs.

This presentation will review:

• Basic SMT Process Overview
• Impacts of miniaturization on SMT systems
• New assembly tests on the UHDI Assembly Test Board
• Vision for the future – UHDI Stackups
• Summary – Pros and Cons of UHDI in SMT

"SMT Specification Performance in PCB Assembly" presented by Mike Sivigny of CeTaQ Americas

Technical Presentation Overview: The focus of this presentation delves into the critical role of Surface Mount Technology (SMT) specifications in optimizing the efficiency and quality of Printed Circuit Board (PCB) assembly processes. Tied to the future of assembly quality with Ultra HDI miniaturization is the critical role of equipment being proficient to do the job correctly the first time.

The presentation will provide a comparative analysis of various SMT equipment and technologies. Data will show the initial 3rd party performance results directly after OEM installation and on-board internal measurement results. This will highlight the current state of OEM installed quality as the equipment is prepared for SMT production.

More importantly, with a 90% initial specification failure rate, OEM equipment manufacturers across the board will need to step up their game to meet the future demands of Ultra HDI manufacturing. The emphasis of quantity over quality needs a strong reality check in today’s PCB assembly because profitability still rules the roost no matter what type of electronic product is manufactured.

To register for the in-person event, visit https://smta.org/events/EventDetails.aspx?id=1867231&group=225199 and click on “Register Here” button.

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