Circuits Assembly Online Magazine - Report: Chiplet Package Market to Grow by 69% by 2029

AUSTIN, TX – TechSearch International is projecting a 69% compound annual growth rate for packages using chiplet architectures from 2023 to 2029, according to its latest Advanced Packaging Update.

Packages shipping in volume production include silicon interposers, fan-out/redistribution layer (RDL) with both chip-first and chip-last designs, and chiplets attached to laminate build-up substrates, including embedded bridge such as Intel’s Embedded Multi-die Interconnect Bridge (EMIB). While some industry participants consider high bandwidth memory (HBM) to be a chiplet application, TechSearch International does not classify it as such, but it is a critical piece of the high-performance AI packaging solution.

Strong growth of 73% CAGR is projected for DRAM wafers used in HBM from 2023 to 2028. Key players including SK hynix, Samsung, and Micron are working to develop hybrid bonding in the future, and many challenges remain. The report presents drivers, timelines, and plans for adoption. High-performance packages, including those for AI training and inferencing, typically use a silicon interposer, but demand for an increased number of HBM stacks is driving the industry to adopt RDL interposers to support eight, 12, or more HBMs. The report describes RDL interposer technology options and suppliers. Alternatives to glass core substrates are also discussed.

While there is great interest in the use of glass core substrates, many challenges remain before the technology sees widespread adoption. TechSearch International’s latest analysis highlights the progress with the technology and identifies remaining challenges.

TechSearch International’s annual survey on substrate design rules is presented, with special coverage of suppliers of laminate flip chip BGA and CSP substrates worldwide. The design rules include body size, core thickness, via and pad diameter, minimum bump pitch supported, and substrate finish. Recent work to manage warpage in large substrates is included, and OSAT financials are highlighted in the report.