SAN JOSE -- Industry veteran Vern Solberg has released a new book on designing for SMT and UHDI boards.

Design Guidelines for Surface Mount and Microelectronic Technology is a guide developed for printed circuit board design engineers focusing on SMT assembly processing; land pattern development; DfM for HDI and UHDI circuit boards; flexible and rigid-flex circuits; advanced semiconductor package technologies; and 2D, 2.5D, 3D and hybrid bond interconnects.

The author, Vern Solberg, is an expert in SMT design and assembly, with over four decades of experience in surface mount, microelectronics and manufacturing technology. He has led multiple industry standards committees for land pattern development, BGAs, and other areas.

The book offers proven methods and techniques for developing a reliable and assembly process-compatible product. The text and illustrations emphasize the relationship between printed circuit board design, manufacturing and assembly processing, and is applicable to product design specialists, material procurement professionals, and those responsible for manufacturing, assembly and product testing.

Key issues include the development of process-compliant land pattern geometry, selecting suitable circuit board base materials, and specifying surface finishes that is most compatible with the termination process selected for assembly.

The book is available at solbergtech.com.

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