PEACHTREE CITY, GA – Printed Circuit Engineering Association (PCEA) today opened registration for the 2025 New Product Introduction (NPI) Awards for electronics assembly equipment, materials and software suppliers. The deadline for submissions for the annual awards is Jan. 3, 2025.

Colloquially referred to as the Engineer’s Choice Awards – a nod to the background and independence of the judges – the 18th annual NPI Awards recognize the leading new products for electronics assembly during the past 12 months. Recipients are selected by an independent panel of practicing industry engineers and are presented by CIRCUITS ASSEMBLY.

The 2024 winners included AIM Solder, Anda Technologies, Arch, ASYS Group, Brooks Automation, BTU International, CalcuQuote, Cetec ERP, Hanwha Techwin Automation Americas, Henkel, Indium, ITW EAE, Juki Automation Systems, Kurtz Ersa, Kyzen, Pemtron, PVA, StenTech, Tagarno, Vayo, ViTrox, and Weller Tools.

How It Works

Entrants must submit a single registration form for each product and category entered. All entries must include a 250- to 1,000-word statement describing the product in the following terms:

• Creativity and innovation
• Compatibility with existing technology
• Cost-effectiveness
• Design
• Expected reliability
• Flexibility
• Expected maintainability/reparability
• Performance
• User-friendliness
• Speed/throughput.

Evaluations will be based on the above list.

The entry fee is $500 per product. The deadline for entries is Jan. 3, 2025.

To be eligible, entries must have been introduced to the market (any region) no earlier than Jan. 1, 2024.

Categories

Equipment: automation tools (conveyors, feeders, etc.); bonders; cleaning equipment; component placement - high-speed; component placement - multifunction; component placement - accessory technologies; component storage; device programming; dispensing equipment; labeling equipment; process control tools; rework and repair tools; screen/stencil printing; screen/stencil printing peripherals/consumables; soldering - reflow (convection); soldering – wave; soldering – selective; selective soldering tools and accessories; soldering – alternative (vapor phase, hot bar, laser, etc.); soldering – hand tools; test and inspection – AOI; test and inspection – AXI; test and inspection – ICT; test and inspection – SPI; test and inspection – functional test; first article inspection; curing ovens (for non-solder materials); ESD

Materials: adhesives; cleaning materials; coatings/encapsulants; underfills; thermal interface materials; flux; soldering materials (paste, bar, wire, core, etc.); cored wire

Software: process control; production; management (ERP, MRP, etc.)

Training Materials

Process Innovation (Open to electronics manufacturing services companies only)

For more information, visit https://www.circuitsassembly.com/ca/editorial/npi-award.html 

Register now at https://na.eventscloud.com/npi2025 

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