PEACHTREE CITY, GA – FEBRUARY 4, 2025 – Printed Circuit Engineering Association (PCEA) will host a new technical conference and exhibition in June in Detroit for printed circuit designers, design engineers, fabricators and assemblers.

PCB Detroit will take place June 2-3 on the campus of Wayne State University. It will include two days of technical sessions, plus a tabletop exhibition on June 2.

Wayne State University is Michigan’s third-largest university, and a licensee of the PCEA Training Certified Printed Circuit Designer curriculum.

The conference will feature speakers on controlling noise, using AI in hardware and PCB design, flex and rigid-flex materials and DfM, HDI via design, and PCB cost drivers, among others. A free reception and special designers meetup (registration required) will take place after classes end on June 2 and 3, respectively.

“Our efforts with Wayne State University have shown there is a vibrant yet underserved electronics community in Michigan,” said Mike Buetow, president, PCEA. “PCB Detroit will help bring world-class experts to help with their new designs and products.”

For more information about PCB Detroit, visit pcea.net/pcb-detroit or contact pcbdetroit@pcea.net.

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