MANASSAS, VA – Zestron has introduced its Reliability and Solutions (R&S) service for printed circuit assembly failure analysis. The service covers design to high-volume production.

Led by Dr. Denis Barbini, the service provides root cause and failure mode analysis for die-level components, PCBAs and enclosures. Zestron’s global network of technical experts ensures reliability testing and supports clients in meeting industry standards.

“This service addresses the increasing demand for high-reliability solutions in critical applications, enabling manufacturers to reduce future failure costs and ensure product performance,” said Barbini.

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