MORRISVILLE, NC – The International Electronics Manufacturing Initiative (INEMI) has released updated roadmaps addressing key challenges and technology advancements in board assembly, complex integrated systems and laminates. The updates reflect growing demands across industries such as high-performance computing, 5G/6G communications, autonomous vehicles, medical electronics and aerospace.

The Board Assembly Roadmap, led by Jasbir Bath (Bath Consultancy LLC) and Paul Wang (MiTAC), highlights developments in SMT materials, rework, CPU sockets and press fit. The Complex Integrated Systems Roadmap builds on a joint INEMI-IPC whitepaper to map technology needs for increasingly complex electronics. The PCB Roadmap now includes a new section on laminates, detailing future requirements and technology gaps, led by Tarja Rapala (EIPC) and Joe Beers (Gold Circuit Electronics).

Francis Mullany, INEMI’s director of Roadmapping, emphasized that advancing manufacturing for complex electronics remains a top priority as the industry faces challenges like miniaturization, faster switching and harsher environments.

A webinar on June 19 will cover highlights of the PCB Roadmap, including laminates, high-speed PCBs, mmWave technologies and environmental concerns, and will explore future directions for PCB manufacturing.

Ed.: Mullany and INEMI's Emma Hudson recently discussed the new roadmap activity on the PCB Chat podcast.

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