HONG KONG – ASMPT said it is considering divesting its surface mount technology (SMT) solutions business after receiving acquisition interest, as the company looks to focus more heavily on end-market businesses and expand investment in areas where it holds stronger competitive advantages.

Chief executive Robin Ng said the company has already attracted potential buyers for the SMT division, signaling a possible strategic shift toward higher-growth semiconductor equipment segments.

The company also expects improved profitability in the first quarter. Gross margin fell 101 basis points year-over-year to 35.8% in the previous quarter, but management anticipates a rebound driven by increased sales of thermocompression bonding (TCB) systems and high-end die bonding machines.

Those products are expected to push the semiconductor solutions segment’s gross margin back toward the mid-40% range. However, the SMT solutions segment is likely to remain under pressure as demand from automotive and industrial markets continues to weaken.

ASMPT shares have significantly outperformed the broader semiconductor equipment sector this year, rising more than 39% year-to-date compared with about 4.7% for the industry average.

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