SINGAPORE – Polymatech has opened a new advanced electronics manufacturing facility in Singapore that will serve as its Asia-Pacific hub for LED chip-on-board (CoB) packaging and advanced memory module assembly.

Backed by an investment of approximately $25 million, the facility is located at Mapletree Hi-Tech Park and is designed to support optoelectronics, advanced packaging and computing applications. The site includes dispensing, packaging, curing, inspection, testing and module assembly systems for high-precision electronics manufacturing.

The operation will focus on LED CoB packaging for UV, infrared and full-spectrum products used in horticulture, medical and industrial applications, as well as memory module assembly for high-performance computing, enterprise and embedded systems. Polymatech said the facility will strengthen supply-chain resilience and improve access to semiconductor markets across the Asia-Pacific region.

The Singapore site becomes part of Polymatech’s global manufacturing network, which includes operations in France, India, Estonia and the United States.

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