Three driving forces are radically changing CAD library construction. The first is lead-free solder. The next is metric units. And lastly is "component manufacturer chaos." This term describes component manufacturers who no longer follow JEDEC packaging standards and are leading the way for new component package development. It seems as though the constraints of standard package data have been thrown out the window and new unique electronic device packages are emerging on the market at light speed. These challenges will continue to impact CAD library development and maintenance as we move forward.

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