NPI Award

Entries must have been introduced to market (any region) no earlier than January 1, 2023 for eligibility.

Entries must comply with all stated rules and requirements. 

Entries must be e-mailed by December 15, 2023. No late entries are accepted.

Winners will be informed by February 1, 2024. Awards will be distributed in Spring 2024.

Winners are selected solely on their product's merits. Prior, existing or pending business relationships with CIRCUITS ASSEMBLY or the Printed Circuit Engineering Association, Inc., are not a consideration.

It is the judges' option not to award a winner in a given category.

There is no limit to the number of categories any company enters. No refunds will be given to companies that do not complete the registration, submit incomplete materials, or are not selected by the judges for an award.

Submit one online entry form per product entered.

Award winners may acknowledge receipt of the award in advertising, promotional material and company stationery.

Judges also reserve the right to move an entry into the category they feel best fits the particular product submitted.

About the Award

CIRCUITS ASSEMBLY'S 17th annual New Product Introduction (NPI) Awards recognize the leading new products for electronics assembly during the past 12 months. Awards are selected by an independent panel of practicing industry engineers, and are presented by CIRCUITS ASSEMBLY.


Entrants must submit a single, complete entry form for each product and category entered. Entries that fail to comply with the submission requirements will result in automatic disqualification. All entries must have been introduced to the marketplace no earlier than January 1, 2023, to be eligible.

All entries must include:

  • A 250- to 1000-word statement describing the product in terms of its creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability, emailed to no later than December 15, 2023.
  • A PDF or Word file of corresponding technical product literature and/or product specifications, emailed to
  • A high-resolution (266 dpi or greater) digital image (.jpg, .tif or .eps).
  • Video not required but encouraged, as applicable.
  • Fee of $500 per product entered

Registrations must be made online at No mailed registrations will be accepted.


Judges have been chosen by CIRCUITS ASSEMBLY from a pool of experienced, practicing industry engineers with no affiliation to any of the entrants. CIRCUITS ASSEMBLY will tabulate all scores. Judges' scores are final; judges will not be made available to communicate with entrants.

Evaluations will be based on the following:

  • Creativity and innovation
  • Compatibility with existing technology
  • Cost-effectiveness
  • Design
  • Expected reliability
  • Flexibility
  • Expected maintainability/ease of repair
  • Performance
  • User-friendliness
  • Speed/throughput

Awards Ceremony

Awards will be distributed in Spring 2024. 

October 2023

Registration for the 2024 NPI Awards are now open.

December 2023

The deadline to register online and provide product materials to PCEA ( is December 15, 2023.

April 2024 

Awards will be distributed in Spring 2024.

An announcement featuring the winners will be published in the April edition of PCD&F/CIRCUITS ASSEMBLY. There are also special advertising opportunities for winners. (Contact Sales ( for advertising questions.)

Registration for the 17th Annual NPI Awards is now open. The deadline for entries is December 15, 2023

Entry fees are $500 (US) per product entry.

*All entrants to the NPI program must read the NPI Terms and Conditions.

How does it work?

1. Register your company online at

2. Submit a single registration form for each product and category entered. All entries must include a 250- to 1000-word statement describing the product in terms of its creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability; a PDF or Word file of corresponding technical product literature and/or product specifications, and a high-resolution (266 dpi or greater) digital image (.jpg, .tif or .eps). Video not required but encouraged, as applicable.Email information to

 That's it!


Automation tools (conveyors, feeders, etc.)
Cleaning equipment
Component placement - high-speed
Component placement - multifunction
Component placement - accessory technologies
Component storage
Device programming
Dispensing equipment
Labeling equipment
Process control tools
Rework and repair tools
Screen/stencil printing
Screen/Stencil Printing Peripherals/Consumables
Soldering - reflow (convection)
Soldering - wave
Soldering - selective
Selective soldering tools and accessories
Soldering - alternative (vapor phase, hot bar, laser, etc.)
Soldering - hand tools
Test and inspection - AOI
Test and inspection - AXI
Test and inspection - ICT
Test and inspection - SPI
Test and inspection - functional test
First Article Inspection
Curing Ovens (for non-solder materials)

Cleaning materials
Thermal Interface Materials
Soldering materials (paste, bar, wire, core, etc.)
Cored Wire

Software - process control
Software - production
Software - management (ERP, MRP, etc.)

Training Materials


Congratulations to the 2023 winners!

Scienscope: Automation Tools (5100c III X-Ray Component Counter)
Surfx Technologies: Cleaning Equipment (STA-10 Automated Plasma System)
Europlacer: Component Placement - Accessory Technologies (Freeform Feeder)
ASYS Group: Component Storage (Reel-Magazine)
ITW EAE: Dispensing Equipment (ITW Camalot Prodigy Advanced Tilt and Rotate)
Selectech: ESD (SelecTile ESD Interlocking Flooring)
Aven Tools: First Article Inspection (Mighty Vue Inspector)
Koh Young: Process Control Tools (Neptune C)
ASMPT: Screen and Stencil Printing (DEK TQ L Printing Platform)
Stentech: Screen/Stencil Printing Peripherals/Consumables (Advanced Nano Stencil Coating)
Koh Young: Software – Process Control (KPO Printer Software)
ASYS Group: Software – Production (Extended ASYCAM Software)
Smartsol: Soldering – Alternative (SMarTsol Soldering Robots)
Weller Tools: Soldering – Hand Tool (WXair Rework Module)
ECD: Soldering – Process Control (MOLE EV6 Thermal Profiler)
SASinno Americas: Soldering – Selective (Unit-i1 Selective Soldering Machine)
ITW EAE: Soldering – Wave (Auto Exit Wing)
Indium: Cored Wire (CW-818 Fast Wetting, No-Clean Cored Wire)
Shenmao: Solder Paste (PF918-PW216 Solder Paste)
Saki Corp.: Test and Inspection – AOI (3Di Series)
Magnalytix: Test and Inspection – Functional Test (OE-300)
Henkel: Thermal Interface Materials (Bergquist Liqui Form TLF 10000)

Past Winners


Arch Systems: Software – Process Control (ArchFX Analytics)
CyberOptics: Test and Inspection – SPI (SQ3000+)
Europlacer Americas: Component Placement – Accessory Technologies (ii-Tab)
Europlacer Americas: Component Placement – High Speed (ii-A2)
EVS International: Soldering – Alternative (EVS 11KLFHS)
Heller Industries: Soldering – Reflow (Convection) (MKV-VF)
Indium Corporation: Adhesives (NC-702)
Juki Automation Systems: Component Placement – Multi-Function (JM-50)
Juki Automation Systems: Component Storage (ISM UltraFlex 3600S)
Koh Young America: Process Control Tools (Neptune C+)
Kyzen: Cleaning Materials (Aquanox A4626)
Omron: Test and Inspection – AOI (VT-S1080 3D AOI)
1 Click SMT: Soldering – Selective (MAS-i4)
PSA Systems: Automation Tools (Matrix Automatic SMT Support Tooling)
Scienscope International: Labeling Equipment (Scienscope IMS-200)       
SPEA: Test and Inspection – ICT (T300 Board Tester)
VJ Electronix: Test and Inspection – AXI (Apogee 90)   


Accu-Assembly: Component Storage (Accu-Stock)
Accu-Assembly: Labeling Equipment (AccuID)
Anda Technologies USA: Dispensing Equipment (iCoat-6)
ASM Assembly Systems: Training Materials (ASM Academy Digital Training)
Brady Corporation: Automation Tools (ALF19-XS Label Feeder)
BTU International: Soldering – Reflow (Health Check Services)
ECD: Selective Soldering Tools and Accessories (SelectiveRIDER)
Elsyca: Plating (Elsyca CuBE)        
EVS International: Soldering – Alternative (EVS 18KLF)
Hanwha Techwin Automation Americas: Component Placement – High-Speed (Decan S1)
Henkel Corporation: Thermal Interface Materials (Bergquist microTIM mTIM 1000)
Indium: Cored Wire (CW-232)
Juki Automation Systems: Soldering – Selective (iCube HighFlex)
Koh Young America: Software – Process Control (KSMART)
Kyzen: Cleaning Materials (Aquanox A4382 OA)
MacDermid Alpha Electronics Solutions: Soldering Materials (Alpha OM-372)
MIRTEC: Test and Inspection – AOI (MV-6Z Omni)
Omron: Test and Inspection – SPI (CKD VP9000)
SelecTech: ESD (FreeStyle ESD Plus)
Viscom: Test and Inspection – AXI (iX7059)

Past Winners


Air-Vac Engineering: Rework and Repair Tools (AVX250)
Anda Technologies: Cleaning Equipment (AP-3P)
Anda Technologies: Curing Ovens (VCO Series)
ASM Assembly Systems: Component Placement – Accessory Technologies (Siplace SmartFeeder AutoRefill)
Cogiscan: Software – Production (Quality Driver Software Suite)
CyberOptics: Software – Process Control (CyberCMM)
CyberOptics: Test & Inspection – SPI (SQ3000)
Data I/O: Device Programming (PSV2800)
Hanwha Techwin: Component Placement – High Speed (HM520)
Henkel: Thermal Interface Materials (Bergquist GAP Pad TGP 10000ULM)
Indium: Soldering Materials (Durafuse)
Inspire Solutions: Automation Tools (Toolmaker)
ITW EAE: Soldering – Wave (Electrovert DwellFlex 4.0)
Juki: Component Placement – Multi-Function (JM-100)
Kyzen: Cleaning Materials (Kyzen E5631)
Magnalytix: Process Control Tools (Magnalytix OE-250 SIR Testing)
Nihon Superior: Cored Wire (TipSave N)
Nordson Asymtek: Dispensing Equipment (Qadence)
Nordson Dage: First Article Inspection (Prospector)
Nordson Dage: Test & Inspection – AXI (Assure Stock Line)
Part Analytics: Software – Management (AI Driven Spend and RFQ Management)
Promation: Soldering – Alternative (Panda)
Rehm Thermal Systems: Soldering – Reflow (Vision TripleX)
Rohde & Schwarz: Test & Inspection – Functional Test (R&S NGM200)
Saki: Software – Production (Quality Driver Software Suite)
Viscom: Test & Inspection – AOI (3D AOI system S3088 DT)
VJ Electronix: Component Storage (XQuik III)
Weller Tools: Soldering – Hand Tools (Weller Active Tip Range)


Aculon: Coatings/Encapsulants (NanoProof 8.5)
AIM Solder: Cored Wire (RX18 No Clean Wire Solder)
ANDA Automation: Cleaning Equipment (In-Line AP-460 Atmospheric Plasma)
ASYS Group Americas: Process Control Tools (RFID Setup Control)
BPM Microsystems: Software – Production (WhisperTeach+)
BTU International: Soldering – Reflow (Aqua Scrub Flux Management)
Data I/O Corp: Device Programming (Job Composer)
ESE: Screen/Stencil Printing (ESE US-2000XF Screen Printer)
Fuji America: Automation Tools (SmartWing Multi Axis Robotic Solution)
Hanwha Techwin: Automation Americas. Component Placement – High-Speed (HM520)
Henkel Corp.: Thermal Interface Materials (Bergquist Gap Pad TGP 7000ULM)
Henkel Corp.: Underfills (Loctite Eccobond UF 1173)
Juki: Component Placement – Multi-Function (RS-1XL)
Juki: Component Storage (Autonomous Material Handling System)
Juki: Labeling Equipment (Incoming Material Station)
Koh Young America: Software – Process Control (Ksmart Process Optimizer)
Koh Young America: Test & Inspection – SPI (KY8030-3)
Kurtz Ersa: Rework and Repair Tools (Ersa HR 600 XL)
Kurtz Ersa: Soldering – Selective (Ersa Versaflow 4XL)
Kyzen: Cleaning Materials (Aquanox A4727)
PVA: Dispensing Equipment (MR2 Metered Rod Dispenser)
Saki Americas: Test & Inspection – AOI (Saki Self-Programming (SSP) Software)
Scienscope: Test & Inspection – AXI (AXC-800 II)
Shenmao America: Flux (SM-862 Liquid Flux)
Thermaltronics USA: Soldering – Alternative (TMT-R9800S Soldering Robot)


Automation Tools: Fuji America (Fuji Smart Nozzle Cleaner)
Coatings/Encapsulants: Henkel Electronic Materials (Package-Level EMI Shielding Materials)
Component Placement – High Speed: Europlacer Americas (Atom 4 Pick and Place Machine)
Component Placement – Multi-function: Europlacer Americas (Atom 3 Pick and Place Machine)
Component Storage: Inovaxe (InoAuto Smart MSD Cart)
Cored Wire: Indium (Core 230-RC “No-Spatter” Robotic Cored Wire)
Device Programming: Data I/O (UFS Upgrade Kit for Lumen X)
Dispensing Equipment: Essemtec (Tarantula – Relentless All Terrain Jet Dispenser)
First Article Inspection: Yxlon (Cheetah EVO Plus Scalable X-Ray Inspection System)
Process Control Tools: Kyzen (Kyzen Analyst)
Process Innovation: Panasonic Factory Solutions Co. of America (Panasonic SPV, Paperless Cleaning Technology)
Rework and Repair Tools: Metcal (Connection Validation Robotic Soldering System)
Screen/Stencil Printing Equipment: Juki (G-Titan Automatic Screen Printer)
Screen/Stencil Printing Peripherals/Consumables: Inovaxe (InoAuto Smart Stencil Rack)
Software – Process Control: Cogiscan (Factory Intelligence – Analytics)    
Software – Production: BPM Microsystems (WhisperTeach)    
Soldering Materials: AIM (REL22 M8 High Reliability Solder Paste)
Soldering – Reflow: R&D VaporTech (Smartphase Inline Vapor Phase Reflow System)
Soldering – Selective: Nordson Select (Integra 508.5 Selective Soldering System)    
Soldering – Other: Promation (Quick 9440IR-U Soldering Robot)
Test & Inspection – AOI: Test Research Inc. (TR7700Q 3D AOI System)
Test & Inspection – AXI: Viscom (Inspection System X7056-II)
Test & Inspection – SPI: CyberOptics (SE3000 SPI)
Underfill/Thermal Interface Materials: Henkel Electronic Materials (Bergquist Gap Filler TGF 1500RW Liquid, Peelable TIM for Easy Rework)


Henkel Electronic Materials (Coatings/Encapsulants)    
Kyzen (Cleaning Materials)
Yamaha Motor Corp. (Component Placement – High Speed)
Essemtec (Component Placement – Multi-function)
Juki Automation Systems (Component Storage)
Data I/O (Device Programming)
DELO Industrial Adhesives (Dispensing Equipment)
Kyzen (Process Control Tools)
Kurtz Ersa (Rework & Repair Tools)
Speedprint Technology (Screen/Stencil Printing Equipment)
Fuji America (Software – Management)
ASM (Software – Process Control)
Cogiscan (Software – Production)
Nihon Superior (Soldering Materials)
ITW EAE – Vitronics Soltec (Soldering – Reflow)
Kurtz Ersa (Soldering – Selective)
OK International/Metcal (Soldering – Hand Tools)
EVS International (Soldering – Other)
Viscom (Test & Inspection – AOI)
Dage Precision Industries (Test & Inspection – AXI)
Test Research Inc. (Test & Inspection – ICT)
Akrometrix (First Article Inspection)
Datest (Functional Test)
Kester (Flux)


ASM Assembly Systems (Automation Tools)
Palomar Technologies (Bonders)
Aculon (Coatings/Encapsulants)
Seika Machinery (Cleaning Equipment)
Kyzen (Cleaning Materials)
Fuji America (Component Placement – High Speed)
Kurtz Ersa (Component Placement – Multifunction)
Inovaxe (Component Storage)
Data I/O (Device Programming)
Techcon Systems (Dispensing Equipment)
Seika Machinery (Process Control Tools)
BEST Inc. (Rework & Repair Tools)
Speedline Technologies (Screen/Stencil Printing Equipment)
Datum Alloys (Screen/Stencil Printing Peripherals/Consumables)
Europlacer Americas (Software – Management)
Kurtz Ersa (Software – Process Control)
Cogiscan (Software – Production)
Henkel Electronic Materials (Soldering Materials)
Kurtz Ersa (Soldering – Reflow)
ACE Production Technologies (Soldering – Other)
Kurtz Ersa (Soldering – Selective)
MIRTEC (Test & Inspection – AOI)    
Scienscope International (Test & Inspection – AXI)
STI Electronics (Training Materials)
Henkel Electronic Materials (Underfill/Thermal Interface Materials)


Panasonic Factory Solutions Co. of America (Automation Tools)
Aqua Klean Systems (Cleaning Equipment)
Kyzen (Cleaning Materials)
Fuji America Corp. (Component Placement – High Speed)
Panasonic Factory Solutions Co. of America (Component Placement – Multifunction)
VJ Electronix (Component Storage)
Nordson Asymtek (Dispensing Equipment)
Indium Corp. (Flux)
SCS Coating Systems (Process Control Tools)
FSInspection (Rework & Repair Tools)
Apex Factory Automation (Screen/Stencil Printing Equipment)
Quick Tensioning Systems (Screen/Stencil Printing Peripherals/Consumables)
Mentor Graphics/Valor (Software – Management)
Vi Technology (Software – Process Control)
BTU International (Software – Production)
The Electronics Group of Henkel (Soldering Materials)
EVS International (Soldering – Other)
ACE Production Technologies (Soldering – Selective)
ViTrox Technologies (Test & Inspection – AOI)    
ViTrox Technologies (Test & Inspection – AXI)
Parmi (Test & Inspection – SPI)
STI Electronics (Training Materials)


Dispensing Equipment: Nordson Asymtek (Spectrum II S2-900 Series)
Soldering - Reflow: ERSA (Hotflow 4/26)
Soldering Materials: Henkel Electronic Materials (90iSC Alloy and Loctite Multicore HF212 Flux Medium)
Screen/Stencil Printing Equipment: Juki Automation Systems and GKG Asia (GL Fully Automatic Solder Paste Printer)
Screen/Stencil Printing Peripherals: Aculon (NanoClear)
Component Placement – Multifunction: Essemtec (Paraquda)
Soldering – Selective: Juki Automation Systems and Inertec (Cube)
Software – Process Control: Cogiscan (Factory Intelligence Monitoring Module)
Test & Inspection – AOI: MIRTEC (MV-7 Omni 2D/3D In-Line AOI)
Test & Inspection – AXI: ViTrox (V810 XXL In-Line 3D AXI)
Rework & Repair Tools: Metcal (Metcal HCT2-120 Digital Hot Air Pencil)
Software – Production: Panasonic Factory Solutions (PanaCIM)
Cleaning Materials: Kyzen (Aquanox A8830 Low VOC Aqueous Stencil Cleaning Agent)       
Bonders: Palomar Technologies (8000i Wire Bonder with i2Gi)
Automation Tools: Count On Tools (StripFeeder Modular (.mod) System v. 2)
Adhesives: Henkel Electronic Materials (Loctite TAF-8800 Thermal Absorbent Film)
Test & Inspection – ICT: Seika Machinery (FA1240-51 Flying Probe Tester)
Test & Inspection – SPI: Parmi (Sigma X)
Soldering – Other: EVS International (EVS 500)
Component Placement – High-Speed: Juki Automation Systems (RX-7 High-Speed Compact Modular Mounter)
Device Programming: Data I/O (PSV7000)
Test & Inspection – Functional Test: Nordson Dage (Camera Assist Automatic Bondtesting)
Cored Wire: Nihon Superior (SN100C (031) Pb-free Flux-Cored Solder Wire)


Process Control Tools: Microscan (Mini Hawk Xi)
Screen/Stencil Printing: Speedprint (SP710avi with Advanced Dispense Unit)
Screen/Stencil Printing Peripherals: Count On Tools (ezLOAD PCB Support System for Screen Printers)
Cleaning Equipment: Austin American Technology (NanoJet Aqueous Inline Cleaning System)
Device Programming: BPM Microsystems (2800ISP Semi-Automated In-System Device Programmer)
Dispensing Equipment: Nordson Asymtek (NexJet System)
Test & Inspection – AOI: Mirtec Corp. (MV-9 2D/3D In-Line AOI Series)
Test & Inspection – ICT: Acculogic (Ultimate Accuracy Package for Flying Scorpion)
Test & Inspection – Functional Test: Multitest Elektronische Systeme (InStrip 3D)
Test & Inspection – AXI: VJ Electronix (Vertex II X-Ray Inspection System) 
Test & Inspection – SPI: Parmi (SPI HS70)
Soldering Materials: Nihon Superior (SN100C P604 D4 Solder Paste)
Automation Tools: Count On Tools (Stripfeeder .mod Series)0
Component Placement – Multifunction: Universal Instruments (FuzionXC2-37 Platform) 
Soldering – Reflow: Rehm Thermal Systems (Vision XP 934 Quad Lane Convection Reflow Oven)
Soldering – Selective: ACE Production Technologies (ACE KISS-205 Selective Soldering with In-Line Concurrent Processing)
Cleaning Materials: Kyzen (Aquanox A4639 Electronic Assembly Aqueous Solution)
Labeling Equipment: Cogiscan (Murata Magicstrap for PCB RFID Tracking Integrated with Cogiscan TTC Middleware)
Software – Process Control: Viscom (SPI-AOI Uplink)
Soldering – Other: EVS International (EVS 10K Solder Recovery Machine)
Coatings/Encapsulants: FCT Assembly (NanoCoat Multilayer System)
Rework & Repair Tools: Air Vac Engineering (PCBRM100)
Flux: AIM (NC277 Liquid Flux)
First Article Inspection: CGI Americas (Newly n=1 First Article Inspection System)


Process Control Tools: Cognex (DataMan 500)
Screen/Stencil Printing Equipment: Speedprint (Speedprint SP700avi)
Screen/Stencil Printing Peripherals: Seika Machinery (Sawa Ultrasonic Stencil Cleaner SC-AH100F-LV Low-VOC Model)
Cleaning Equipment: Aqueous Technologies (Trident XLD)
Device Programming: Data I/O Corp. (RoadRunner 3 with FIS)
Dispensing Equipment: GPD Global (PCD Dispensing on MAX Series Platform)
Test & Inspection – AOI: CyberOptics Corp. (QX100)
Test & Inspection – ICT: Datest (SPEA 4060 Flying Probe Tester with Goepel Boundary Scan)
Test & Inspection – Functional Test: Agilent Technologies (Agilent TS-8900)
Test & Inspection – AXI: ViTrox Technologies (V810 In-Line 3D AXI) 
Soldering Materials: AIM (NC259 Solder Paste)
Automation Tools: LPKF Laser & Electronics (LPKF MicroLine 1120 P)
Component Placement – Multifunction: Assembléon America (iFlex) 
Component Placement – High-Speed: Juki Corp. (Sentry)
Soldering – Reflow: Speedline Technologies (Closed Loop Nitrogen Control)
Soldering – Selective: SEHO Systems (AOI System to be embedded in Selective Soldering Machine)
Cleaning Materials: Kyzen Corp. (Aquanox A4638)
Labeling Equipment: Cogiscan (LabelScan Automated Vision System)
Software – Production: Juki Corp. (Juki IS NPI+ Bundle) 
Software – Process Control: Microscan (AutoVISION Machine Vision Software)
Soldering – Other: EVS (EVS 7000LFHS Solder Recovery System Redesign)
Cored Wire: Nihon Superior (SN100C (551CT) Lead-Free Flux-Cored Solder Wire)
Coatings/Encapsulants: Semblant Inc. (SPF (Semblant Plasma Finish))
Rework & Repair Tools: Christopher Associates (Magnus HD Trend)
Soldering – Wave: KIC (KIC 24/7 Wave)
Surface Treatment: Dow Electronic Materials (Circuposit Hole Prep 4126 Sweller)


Process Control Tools: KIC (MVP – Manual Virtual Profiling Fixture)
Screen/Stencil Printing Equipment: Milara (TD2929)
Screen/Stencil Printing Peripherals: DEK (Nano-ProTek)
Cleaning Equipment: Aqueous Technologies (Trident Zero)
Device Programming:
BPM Microsystems (2800 Concurrent Programming System)
Dispensing Equipment:
GPD Global (PCD Dispensing)
Test and Inspection – AOI: CyberOptics (QX500 AOI System)
Test and Inspection – ICT: Datest (SPEA 4060 Flying Probe Tester)
Soldering Materials: FCT Assembly (NL930PT Pin Probable Solder Paste)
Automation Tools: Count On Tools (LED Nozzle Series)
Component Placement – Multifunction: Essemtec (Cobra SMT Pick-and-Place)
Component Placement – High-Speed: Universal Instruments (Advantis 3 Platform)
Soldering – Reflow: BTU (Pyramax with Dual Lane Dual Speed Capability)
Soldering – Selective: Juki (FlexSolderWave FSW620-EF)
Cleaning Materials: Kyzen Corp. (Aquanox A4705)
Labeling Equipment: ASYS Group Americas (Insignum 2000)
Software Production: ASYS Group Americas (Simplex: Natural User Interface)
Bonders: Palomar Technologies (3800 Die Bonder)
Software/Process Control: Speedline Technologies (SPI Print Optimizer)
Soldering – Other: EVS International (EVS 7000LFHS)
Cored Wire: Nihon Superior (SN100C (044) Solder Wire)
Coatings/Encapsulants: Henkel Electronic Materials (Macromelt OM341)
Rework & Repair Tools: VJ Electronix (SRT Micra)
Software – Management: Mentor Graphics (Valor vManage Materials Manager)
Flux: Nihon Superior (NS-F900)
Test and Inspection – AXI: Christopher Associates (Akila XR-3 PCB Inspection System)
Final Finish: Dow Electronic Materials (Aurolectroless SMT-520)
System Modeling and Simulation Tools: National Instruments (NI Multisim 11.0.1)
Design Verification Tools: National Instruments (NI Multisim Component Evaluator)
PCB Design Tools: Allied Electronics (DesignSpark PCB)
Laminates: Rogers (RT/duroid 6035HTC)
Registration and Tooling: XACTPCB Ltd. (XACT X-section)


Automation Tools: Production Solutions Inc. (RED-E-SET Ultra HD)
Cleaning Equipment: Aqueous (Trident Quad)
Cleaning Materials: Kyzen Corp. (Aquanox A4703)
Component Placement-High-Speed: Assembléon (MC-24X)
Component Placement-Multi-Function: Europlacer (XPii-II SMT Assembler)
Device Programming: Data I/O (FlashCORE III)
Labeling Equipment: Polyonics (XF-781 Thermal Transfer Printable Polyimide)
Materials-Flux: FCT Assembly (NC160 Flux)
Process Control Tools: KIC (e-Clipse Thermocouple Attachment)
Rework/Repair Tools: R&D Technical Services (Vaporworks 24 Rev 2)
Screen/Stencil Printing: DEK International (VectorGuard Platinum Dual Layer Stencil)
Software-Production: Panasonic Factory Solutions Co of America (PanaCIM Enterprise Edition)
Software-Process Control: Microscan (TTC Solution)
Software-Management: Valor (MSS)
Soldering-Materials: Cobar Solder Products (Aquasol)
Soldering-Reflow: Speedline Technologies (OmniMax Reflow Soldering System)
Soldering-Selective: Juki Corp. (Inline Flex Solder W510)
Soldering-Wave: SEHO Systems (SEHO Real-Time Fluxer Control)
Soldering-Other: EVS International (EVS 9000 Solder Dross Recovery Solution)
Test & Inspection-ICT: Acculogic Inc. (FLS980Dxi Flying Scorpion)
Test & Inspection-AOI: Koh Young (Zenith 3D AOI System)
Adhesives: Henkel Corporation (Hysol Eccobond CA3556HF)
Laminates: Rogers Corporation (RO4360 Thermoset)
Imaging: WKK Distribution Ltd. (X-Pose SM120 Exposure System)
System Modeling and Simulation Tools: National Instruments (NI Multisim 11.0 Circuit Simulation & Analysis Software)
PCB Design Tools: Sunstone Circuits (PCB123)2009


Automation Tools: ASYS (FIFO Buffer System FPS30B)
Cleaning Equipment: Speedline Technologies (Electrovert’s Aquastorm 100)
Cleaning Materials: Kyzen Corporation (Aquanox A4241)
Component Placement - High-Speed: Juki Corp. (FX3)
Component Placement - Multi-Function: Juki Corp. (JX100)
Device Programming: BPM Microsystems (Flashstream –C)
Dispensing Equipment: Asymtek (DispenseJet DJ-100)
Labeling: Polyonics (Product Sentry)
Materials-Flux: Nihon Superior (NS-F850)
Process Control Tools: KIC (RPI)
Rework/Repair Tools: VJ Electronix (400ST)
Screen/Stencil Printing: Milara (TD2929 Automatic Inline Printer)
Screen/Stencil Printing: Assembléon (Yamaha YGP)
Software-Production: Juki Corp. (Intelligent Shopfloor Solutions)
Soldering-Materials: Henkel Corporation (Multicore LF700)
Soldering-Reflow: Heller Industries (Mark 3.5 Series)
Soldering-Selective: Juki Corp. (Flex Solder Series)
Soldering-Other: EVS International (EVS 7000 Solder Dross Recovery)
Test & Inspection-AXI: Dage Precision Industries (Dage XD7600NT100)
Test & Inspection-ICT: Agilent Technologies (Cover Extend)
Test & Inspection-AOI: Mirtec Corp. (Mirtec MV-3L)
Underfills: Henkel Corporation (Hysol UF3800)
Soldering-Hand Tools: OK International (Metcal MX-5000 Series)


Automation Tools: Inovaxe (InoCart-MSD)
Cleaning Equipment: Aqueous Technologies (Trident)
Cleaning Materials: Kyzen (Aquanox A4625B)
Component Placement–High-Speed: Siemens (SIPLACE X4i)
Component Placement–Multi-Function: Europlacer (iineo)
Device Programming: BPM Microsystems (Flashstream)
Dispensing Equipment: Ovation Products (Stinger)
Labeling: Polyonics (Polyimide Label Stock)
Materials-Flux: Nihon Superior (NS-F850)
Process Control Tools: ECD (Megam.o.l.e. 20 Thermal Profiler)
Rework/Repair: R&D Technical Services (Vapor Works 24)
Screen/Stencil Printing: ICON Technologies (ICON i8)
Software-Management: Optimal (Optel)
Software-Process Control: DEK (Instinctiv V9)
Software-Production: Juki (OPASS)
Soldering-Materials: Nihon Superior/Balver-Zinn/DKL/FCT (SN100C)
Soldering-Reflow: Speedline Technologies (Electrovert IFC)
Soldering-Selective: Juki (Juki 350)
Soldering-Other: EVS International (EVS 1000 Solder Recovery System)
Test & Inspection–AXI: VJ Electronix (Vertex Series "A")
Test & Inspection–ICT: Everett Charles Technologies (Gemini Spring Pin)
Test & Inspection–AOI: Mirtec (MV-7L)
Underfills: Henkel (Loctite 3508)

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