CIRCUITS ASSEMBLY'S 20th annual New Product Introduction (NPI) Awards recognize the leading new products for electronics assembly during the past 12 months. Awards are selected by an independent panel of practicing industry engineers, and are presented by CIRCUITS ASSEMBLY.

Requirements

• A 250- to 1000-word statement describing the product in terms of its creativity and innovation, compatibility with existing technology, cost-effectiveness, design, expected reliability, flexibility, speed/throughput improvements, performance, user-friendliness, and expected maintainability and reparability.
  
• A PDF or Word file of corresponding technical product literature and/or product specifications.
• A high-resolution (300 dpi or greater) digital image (.jpg, .png, .tif or .eps).
• Video not required but encouraged, as applicable.
• All submission statements and corresponding materials must be emailed to npi@pcea.net no later than December 4, 2026
• Fee of $500 per product entered

Criteria

Entrants must submit a single registration form for each product and category entered. All entries must include a 250- to 1,000-word statement describing the product in the following terms:

• Creativity and innovation
• Compatibility with existing technology
• Cost-effectiveness
• Design
• Expected reliability
• Flexibility
• Expected maintainability/reparability
• Performance
• User-friendliness
• Speed/throughput.

Categories

Equipment: automation tools (conveyors, feeders, etc.); bonders; cleaning equipment; component placement - high-speed; component placement - multifunction; component placement - accessory technologies; component storage; device programming; dispensing equipment; labeling equipment; process control tools; rework and repair tools; screen/stencil printing; screen/stencil printing peripherals/consumables; soldering - reflow (convection); soldering – wave; soldering – selective; selective soldering tools and accessories; soldering – alternative (vapor phase, hot bar, laser, etc.); soldering – hand tools; test and inspection – AOI; test and inspection – AXI; test and inspection – ICT; test and inspection – SPI; test and inspection – functional test; first article inspection; curing ovens (for non-solder materials); ESD

Materials: adhesives; cleaning materials; coatings/encapsulants; underfills; thermal interface materials; flux; soldering materials (paste, bar, wire, core, etc.); cored wire

Software: process control; production; management (ERP, MRP, etc.)

Training Materials

Process Innovation (Open to electronics manufacturing services companies only)

Judging

Judges have been chosen by CIRCUITS ASSEMBLY from a pool of experienced, practicing industry engineers with no affiliation to any of the entrants. CIRCUITS ASSEMBLY will tabulate all scores. Judges' scores are final; judges will not be made available to communicate with entrants.

Awards Presentation 

Awards will be distributed in Spring 2027.

Terms and Conditions

Entries must have been introduced to market (any region) no earlier than January 1, 2026 for eligibility. Entries must comply with all stated rules and requirements. No late entries will be accepted.

Winners will be informed in March 2027. Awards will be distributed in Spring 2027.

Winners are selected solely on their product's merits. Prior, existing or pending business relationships with CIRCUITS ASSEMBLY or the Printed Circuit Engineering Association, Inc., are not a consideration.

It is the judges' option not to award a winner in a given category. Judges reserve the right to move an entry into the category they feel best fits the particular product submitted.

Entry fee must be received for product to be considered. There is no limit to the number of categories any company enters. No refunds will be given to companies that do not complete the registration, submit incomplete materials, or are not selected by the judges for an award. Submit one online entry form per product entered.

Award winners may acknowledge receipt of the award in advertising, promotional material and company stationery.