Build-in cleaning time during chemistry changeovers and after extended line shutdowns.
Much time and planning are invested in the choice of the ideal conformal coating material and process to adequately protect printed circuit boards. This often includes multiple qualification trials. There is also sometimes long and detailed testing in areas such as electrical performance, flame resistance, and thermal or mechanical cycling. Unfortunately, the qualification and testing process for conformal coatings is simply a snapshot of the process at the start. To maintain consistency, an often-overlooked activity remains: regular cleaning and flushing of the selective conformal coating equipment.
In general, the following comments and guidelines are designed for a discussion involving typical modern selective coating equipment (FIGURE 1). However, nearly all the principles are applicable to manual spraying operations as well.
Flux becomes increasingly tenacious the longer it sits on the board.
This month our topic is not so much a defect as something to consider when running environmental tests before any destructive analysis on solder joints. The through-hole joints shown in FIGURES 1 and 2 were soldered with a high-temperature alloy as part of our trials on robotic laser and single point soldering. The amount of flux in high-temperature cored wire tends to be higher, hence more residues after soldering. If sample boards will be exposed to high-temperature storage, in this case 200°C for 1,000 hr., or temperature cycling, clean the residues first. It is much more difficult to clean after this level of aging, and mounting samples in epoxy for microsections is much more difficult.
Many “topical” conferences are not just good at answering questions, but they also open one’s eyes to questions that have yet to be resolved.
The ITI/IPC 2019 Conference on Emerging & Critical Environmental Product Requirements is a perfect example. The two organizations caravanned across the US in June, bringing scores of environmentally conscious engineers and compliance officers up to date on the latest REACH and related regulations in the EU, UK and Asia.
What distinguishes REACH from almost any chemical safety regulation I can think of – including RoHS – is parties need to prove the safety of a substance before it’s allowed on the market, and exemptions must be justified from both a risk point-of-view and a socio-economic point-of-view. Multiple independent technical committees, appointed by the Member States, make those assessments.
As the challenges of training evolve, so does the definition of lean.
An organization cannot become lean without tons of training.
Think about that oxymoron for a moment. It takes time to train, time that a lean organization cannot sacrifice. Training in this industry, which utilizes many varying yet intertwined processes, has traditionally taken the form of on-the-job training (OJT) versus a formal, classroom-style format. In any organization, especially a lean one, OJT is much easier to administrate and far less disruptive to employees and production than other types of training. In a service industry, even in support positions off the shop floor, it is much easier to take someone offline and plunk them down for formal training. In a lean manufacturing environment, however, excess resources in any given job function or department are rare. Hence, most training is integrated into the daily workflow as OJT.
It’s adding unnecessary costs to your supply chain.
Want a more robust and cost-effective supply chain? Shrink it. Remove the expensive middleman. You don’t need to pay a PCB broker a 20 to 40% markup to, basically, relay information from you to overseas vendors.
The truth is the PCB broker business model – where companies buy printed circuit boards from an overseas manufacturer and then resell them to a customer – is outdated. And it’s adding unnecessary costs to your supply chain.
Years ago, brokers were small operations, with perhaps three to five people. And at one time, they did provide a valuable service to their customers, offering lower prices on boards made overseas, while handling all the details of procurement from foreign vendors in what was often a challenging PCB buying cycle.
Inappropriately sized pads can result in excessive solder and, eventually, defects.
This month we show soldering of 01005 chip resistors from an early project with lead-free assembly. The microsection image in FIGURE 1 shows a few issues, but it’s the circles in both joints that caught my eye. Yes, they are voids before they are unmasked. During sectioning we stopped just before entering the void. Most would have continued a few more micros to remove the thin sliver of solder, which was the wall of the void, to show the void. But everyone has seen voids before!