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Features Articles

Robert Boguski

Needed: Solder joint forensic scientist. Common sense preferred.

Wanted: X-ray engineer. A test engineer with an interest in x-ray technology will suffice. So will a skilled and teachable technician. Hell, an intelligent person with a pulse will do in this economy. We’re open-minded. Just show us. No shrinking violets here. Honesty still matters to us (like being honest about the state of the economy and its effects on available talent). You should be honest, too, if you’d like us to hire you. Bring the aptitude; we’ll give you the qualifications.

We will train you.

 

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David Bernard

IPC-STD-001 is revising criteria for voiding and fill percentage.

In my September column, I spoke with Dave Hillman about IPC committee work on voiding guidelines for QFN central pad terminations. But he also told me the J-STD-001 task group increasingly receives requests from users for additional information and clarification of x-ray usage in other areas. This is because use of x-ray technology for analyzing solder joints has resulted in significant soldering process improvements. As with all technology introductions, however, the benefits and questions that result from the new information provided must be characterized, assessed and disseminated into practical form. One such area where x-ray technology has provided a tremendous amount of new information is plated through-hole (PTH) solder joints. The “insides” of these joints were previously “hidden” from scrutiny, unless subject to destructive methods, and the standards writers will need time to carefully revise old criteria to accommodate this new information. With this in mind, IPC formed a task group (called Team Skeleton) to discuss this and other matters, with the goal to develop additional x-ray-related guidelines and requirements for inclusion in future IPC documentation. As usual, Dave says, “All are welcome to participate and provide their comments and suggestions.”

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Peter BigelowThe simplest motivational measures can go a long way with tomorrow’s workers.

The past couple years have been good ones. Despite increased and costly quality protocols, foreign competition, escalating raw material costs and fewer material suppliers – and even the advent of punitive tariffs – business has been good. With fewer negative issues to contend with, the one that continues to be most talked about is the difficulty to locate, recruit, develop, and retain quality employees. Indeed, this may be the challenge of our times. As older employees approach retirement, ones who are just beginning their careers seem less interested in manufacturing as a career path than at any time we can remember.

This talent gap threatens to upturn our industry – nay, most industries – more dramatically than any new disruptive technology. Much has been said about the difficulties attracting millennials to our industry. Many initiatives have been started to educate, entice and attract younger people to companies that build technology, products and the “things” we need and use in our day-to-day lives. Some have been more successful than others, but none has been a silver bullet that works all the time in every circumstance, across all industries. While creating work environments that more resemble a summer camp than a place to produce high-quality, complex products may be the way to emulate the software-centric businesses so many millennials yearn to be part of, maybe there is a simpler approach.

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Sue MuchaWould you stake your reputation on a new supply chain in a new region?

The one predicable outcome of trade wars is they tend to make sourcing teams evaluate their outsourcing strategies. Given  that project requirements and cost drivers change over time, even without fluctuating tariffs, periodic evaluations can help better align electronics manufacturing services (EMS) partners with current needs. That said, moving to mitigate tariff concerns alone can create a cascade of unplanned costs that far outweigh the cost of tariffs.

Areas to evaluate when considering a move include:

 

 

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Mike BuetowIt was 16 years ago this month when a group of Chicago-area printed circuit board manufacturers stuck a flag in the ground and declared themselves the new vanguard of the American industry. At an early meeting, leaders called free trade “the seed of our own destruction,” and railed against the devastation of the domestic fab industry.

They called on public officials to fight China on currency manipulation and tariffs, and to enact trade policy that better fit the current state of the domestic market. Nothing less than the long-term security of the US was at stake.

The group had a point: Domestic PCB production had fallen by half in three years to $5 billion. Not only was no recovery in sight, but in some cases the deck seemed stacked against them. For instance, raw materials imported to the US from Asia were assessed tariffs, but assembled PCBs were not. Ouch.

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Clive AshmoreHow proper investigative work can alleviate misguided print process adjustments.

Printing is arguably one of the most sensitive processes within the entire PCB assembly operation. Not surprisingly, stencil printing’s multi-input interdependency and sensitivity have become more pronounced as miniaturization has taken hold. Even slight variations can cause process shifts, a reality our team was reminded of while conducting recent internal testing.

Our engineers set up a test with a really long board run to evaluate time to bridge, a fairly standard analysis used to understand how many PCBs can be printed for a particular product until solder paste bridging begins to appear. The evaluation, which was performed using a relatively complex ASM test board, was proceeding beautifully until we noticed a sudden shift in the output. The measurable Sigma shift went from a process running at 4 Sigma (1.33 Cpk) to 3 Sigma (1.0 Cpk). The engineer running the evaluation was looking at the process window and robustness, beginning at a 10,000 ft. view with a box plot, which gives reasonable stability insight across the entire run. When a more granular examination of the data was conducted, the data spike appeared on three boards in the batch, with one PCB being more extreme.

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