Why “dye and pry” is a fast, workable solution.
This month we show examples of testing BGAs with a “dye and pry,” a simple and cost-effective way of looking at joint failure or their condition after some form of mechanical testing or abnormal assembly practice.
FIGURE 1 shows a sample BGA joint after dye-and-pry testing. Eighty percent of the separated surface is covered by the red dye. This clearly shows separation occurred before the dye was added.
Disaster planning should be part and parcel of our business toolkit.
With only two months of the year behind us, it may be prudent to take any and all business plans you had and rip them up.
Entering a new year is always exciting, when embarking on interesting initiatives that will generate greater profits. Regrettably, sometimes disruptions sideline those exciting new thoughts, replaced by triage efforts that were never in your plans. This year that disruptive event is the coronavirus, and businesses are trying to work through a potentially altered global supply chain.
First and foremost, the coronavirus is just that: a virus – a highly contagious disease debilitating thousands around the world who have or will contract it. Our first thoughts must be with the victims who are infected, hoping they recover. And yes, other viruses and diseases over the years have wreaked havoc on various locations, countries and peoples. By itself, the coronavirus should not derail business planning, business plan execution, or business itself. However, sometimes “things” happen!
In 2018 the US Department of Commerce conducted an industrywide survey of all the nation’s printed circuit board manufacturers. Fabricators groused about the scale of the paperwork, which was massive, as well as the focus of the questions, which in many cases required extraordinary data mining to provide the sought-after information. Still, the rationale for the Bare Printed Circuit Board Supply Chain Assessment was sound: That American PCB capacity issues extend beyond military needs into the medical, automotive and telecom sectors, and that Washington was largely unaware of the degree the nation’s supply base has degraded relative to the rest of the world over the past two decades.
The findings made it into an interagency report titled “Assessing and Strengthening the Manufacturing and Defense Industrial Base and Supply Chain Resiliency of the United States” and was provided to President Trump that same year, showing bureaucracy is still capable of moving at times. Even better, they correctly summarized the situation:
Expand your manufacturing base at little or no cost.
Why are PCB purchasing departments often hesitant to move business to a new vendor, even when it is clearly warranted? Perhaps it’s the overly cumbersome process many buyers require before production can be moved.
Adding a new supplier to an approved vendor list (AVL) needs to be done with care, but I don’t understand why many firms make it harder than it has to be.
It is important to keep PCB vendors on their toes. They should know that you, as a circuit board buyer, regularly review vendor pricing and performance and are willing to move business when necessary. And the truth is adding qualified suppliers may not be as difficult as you think.
When solder isn’t shaped correctly, the condition is known as head-in-pillow.
This month we show the ball surface on area array packages where no solder joint was formed. The joints were intermittent, but one of the surfaces – either the ball or the surface of the solder on the pad – was deformed. This is better known as head-in-pillow (HiP) or head-on-pillow (HoP), depending on the shape formed on the solder adjacent surface.
FIGURES 1 and 2 show examples of HiP/HoP. In Figure 1, the surface of the ball is shown after mechanically separating the device from the board. The indent of the solder from the pad on the board is visible.
Not sure how to tackle an alignment issue? These tips might help set you straight.
In today’s slang, a “life hack” is any trick, shortcut, or proven workaround for a given task that increases productivity and efficiency. And, as regular readers will be acutely aware, this column’s focus is all about improving printing productivity and efficiency. So, I thought a series of “screen-printing hacks” might be helpful to engineers, no matter the level of experience. Throughout 2020, this space will periodically delve into various screen-printing hacks; an issue central to a good print outcome will be identified, and I’ll cover some ways to get the process back on track if something goes awry. The first installment of our screen-printing hack series is alignment.
The goal for the printing process is 100% alignment; the solder paste must align with the feature (the pad) on the substrate. When the solder paste inspection (SPI) system indicates this is not the case and offsets (paste not centered on the pad) are present, an alignment issue is most likely the culprit. Where do you start? Here’s a list of the most common causes and potential fixes; i.e., hacks: