Stop tweaking the ground pad prints; start tweaking the I/O prints.
The new year brings unprecedented promise – and challenges.
Fabricators, already under the gun from a shrinking supply base, higher raw material costs, a scarcity of qualified personnel, and margin pressures, face yet another persistent threat: over-certification.
Poor plating can mean outgassing, creating this cosmetic defect.
When print results are out of spec, board thickness could be to blame.
Is via-in-pad a solution for dense flex boards?
Page 106 of 159
View the DigitalEdition Here!