Features Articles
Thin boards are prone to vacuum suction, increasing the risk of over-prints.
Despite the provocative headline, this column is not a rant about how much I despise defects or the havoc they wreak on yields and profits; that’s already well established! Rather, this month’s space will focus on dedicated tooling and print platform vacuum control.
One culprit could be package warping.
Figure 1 shows the Amkor TMV package after microsectioning the board assembly during failure analysis. This particular view shows open joints between the top package and the solder spheres on the bottom package.
Connectivity is embedded in the electronics ecosystem. And test should be embedded in the devices that support it.
The Internet of Things (IoT) is the new buzzword coined to describe the use of smart and connected electronic devices that enable greater efficiency and productivity in our daily lives.
Print and money: How the West’s inflexibility costs us all.
Some things our industry does are simply extraordinary!
The technology we’ve imagined, created, developed and harnessed has been nothing less than awe-inspiring.
For those who count on the electronics industry for big feats, it’s been a remarkable couple of years.
Press Releases
- KIC to Exhibit at Four SMTA Expo & Tech Forums in August
- Genie Electronics Leverages Cetec ERP for Superior Efficiency and Customer Service
- Automatic Nozzle Height Adjustment Reduces the Potential for Soldering Defects in Wave Soldering Processes
- BTU International Appoints E-Tronix as Its Representative in Six States