Circuits Assembly Online Magazine - Features

Features Articles

Boundary scan is the present and the future. Are you ready?

Boundary scan has been widely adopted to maintain test coverage and board quality.

3D packages, fan-out WLPs, and the migration to copper wire bonding highlighted ECTC.

A thousand people gathered at the Electronics Components and Technology Conference (ECTC) in Orlando, FL, last month to discuss the latest trends in electronics packaging and assembly.

How to capture color values and light intensity.

The world of light-emitting diodes has seen a plethora of new applications in various devices, with vast improvements in energy efficiency, a wide range of color, longer lifecycles and so on.

Lean principles apply to sourcing strategy and manufacturing execution.

Successfully competing in the market still means having the high-quality products your market wants, when and where they want them. However, the new twist is competing globally for available material, while maintaining enough operational efficiency to price competitively and still make a profit.

Every new year brings the promise of change.

It’s the beginning of a new year. Hard to believe the last one is gone, especially as it was not bad, as years go. Some years are more special than others.

The money needed to play in the highest-performance space has forced everyone but IBM to the sidelines.

Once upon a time, there were many major computer makers in the world, and they developed and marketed expensive high end computational systems, spent a lot of money developing cool technology, and had impressive manufacturing operations.