PCB East
February 2021 Issue
Published: 10 February 2021
by Mike Buetow
- How QFN package construction affects solder joint durability
- Effects of under-stencil wipe chemistry on SMT printing
- The future of desktop PCB tools
- Overcoming Covid stagnation
- Post-Covid sales and marketing
- Common stencil printing problems
- Solder toes
- Download the pdf
Press Releases
- NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
- Cofactr Democratizes their Complete Procure-to-Ship Automation Service at a Pivotal Moment for US, Unlocking Support for Agile Hardware Manufacturers in America—with No Upfront Costs
- Semi-Kinetics Adds 2nd Pemtron X-Ray Inspection and Component Counting Capabilities as Part of California Expansion
- The Training Connection Continues to Grow with Addition of Veteran IPC Trainer Bill Graver