News
Austin, TX -- Increased demand in 2005 resulted in longer delivery times and price increases for laminate flip chip build-up substrates, according to market research firm TechSearch International. While several companies have since added capacity, the situation is expected to remain much the same through the end of this year.
Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks).
However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified.
For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
Installed capacity requires time for qualification before substrates can be shipped for production. Approximately 25 weeks are needed to complete incoming engineering evaluation (2 weeks), engineering build (8 weeks) and actual qualification testing (15 weeks).
However, TechSearch notes that the situation should improve in 2007 and 2008 as additional capacity is installed and qualified.
For its analysis, the firm interviewed two dozen laminate substrate suppliers to determine production capacity for build-up FC-PBGA, wire bond PBGA, and laminate CSP substrates.
SAN JOSE – Worldwide revenue of EMS companies reached $190 billion in 2005, up 14% over 2004, according to a report issued today by Electronic Trend Publications.
According to ETP, the EMS industry was responsible for 23% of the total worldwide electronics assembly, valued at $810 billion. The $190 billion includes all the work done by the EMS companies for OEM customers, explained spokesman Steve Berry.
According to ETP, the EMS industry was responsible for 23% of the total worldwide electronics assembly, valued at $810 billion. The $190 billion includes all the work done by the EMS companies for OEM customers, explained spokesman Steve Berry.
SHENZHEN -- Foxconn has admitted to working employees more than twice China's legal limits.
As reported by Circuits Assembly on June 14, the contract assembler was alleged to have been directing its hourly staff to work as much as 80 extra hours each month.
China labor law permits employees to work no more than 36 hours of overtime per month.
As reported by Circuits Assembly on June 14, the contract assembler was alleged to have been directing its hourly staff to work as much as 80 extra hours each month.
China labor law permits employees to work no more than 36 hours of overtime per month.
Jersey City, NJ – Cookson Electronics Assembly Materials had 23 applications engineers trained and certified as IPC Specialists in May.
“At Cookson Electronics, we are focused on helping our customers meet their electronic assembly objectives by providing them with innovative assembly products and the highest possible level of technical assistance,” said Steve Brown, director – Global Applications Technology. “We train and certify our field applications engineers to the IPC Standards which are used globally by our customers. This is especially important as they transition to lead-free processes in response to the RoHS requirements.
The standards covered during the training session were IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610D Acceptability of Electronic Assemblies.
“At Cookson Electronics, we are focused on helping our customers meet their electronic assembly objectives by providing them with innovative assembly products and the highest possible level of technical assistance,” said Steve Brown, director – Global Applications Technology. “We train and certify our field applications engineers to the IPC Standards which are used globally by our customers. This is especially important as they transition to lead-free processes in response to the RoHS requirements.
The standards covered during the training session were IPC J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610D Acceptability of Electronic Assemblies.
Minneapolis, MN -- The SMTA is again co-locating SMTA International with the Assembly Tech Expo this September in Rosemont, IL. The program will consist of over 100 technical papers, 26 tutorials and special symposiums on Contract Manufacturing, Staying Competitive and Lead-Free Soldering Technology, as well as various free events.
The technical sessions are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS, and Process Control.
Full- and half-day educational courses will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality, and Process Control.
The Emerging Technologies Summit will feature sessions on Packaging Space: Nano to Outer, Wireless Technology and Using RFID to Add Value to Your Products and Services. It will conclude with an Emerging Technologies Panel.
The Contract Manufacturing Symposium will consist of two paper sessions: Exploring the Dollars and Sense of EMS and EMS Program Management. The Lead-free Symposium will feature paper sessions on the Joint Council on Aging Aircraft/ Joint Group on Pollution Prevention Lead-Free Solder Project, Lead-Free Manufacturing Experiences and Lead-Free Industry Standards, Lead-Free Fatigue, and Accelerated Life Testing for Lead-Free Solder Joints.
A new Symposium on Staying Competitive in the Global Market will address how to improve your competitive position in your market. The emphasis is on North American issues related to cost, productivity, automation, finance and quality.
Free events include:
The Opening session: What’s Next? Global RoHS and Emerging Technologies
Future Directions for Packaging
NPI and Rapid Setup Aid time to Market
iNEMI Roadmaps
Standards Update
Emerging Technologies
Selecting the Right Lead-Free Cleaning Process
Problem Solving and Reliability Modeling
The conference will include a full day workshop, “Beyond RoHS and WEEE: Preparing for the Energy-Using Products (EuP) Directive & Design for Environment,” co-sponsored by the SMTA, Technology Forecasters and The GoodBye Chain Group.
The technical sessions are organized into tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS, and Process Control.
Full- and half-day educational courses will focus on Manufacturing and Assembly, Advanced Packaging, Substrates, Soldering, Test/Inspection/Quality, and Process Control.
The Emerging Technologies Summit will feature sessions on Packaging Space: Nano to Outer, Wireless Technology and Using RFID to Add Value to Your Products and Services. It will conclude with an Emerging Technologies Panel.
The Contract Manufacturing Symposium will consist of two paper sessions: Exploring the Dollars and Sense of EMS and EMS Program Management. The Lead-free Symposium will feature paper sessions on the Joint Council on Aging Aircraft/ Joint Group on Pollution Prevention Lead-Free Solder Project, Lead-Free Manufacturing Experiences and Lead-Free Industry Standards, Lead-Free Fatigue, and Accelerated Life Testing for Lead-Free Solder Joints.
A new Symposium on Staying Competitive in the Global Market will address how to improve your competitive position in your market. The emphasis is on North American issues related to cost, productivity, automation, finance and quality.
Free events include:
The Opening session: What’s Next? Global RoHS and Emerging Technologies
Future Directions for Packaging
NPI and Rapid Setup Aid time to Market
iNEMI Roadmaps
Standards Update
Emerging Technologies
Selecting the Right Lead-Free Cleaning Process
Problem Solving and Reliability Modeling
The conference will include a full day workshop, “Beyond RoHS and WEEE: Preparing for the Energy-Using Products (EuP) Directive & Design for Environment,” co-sponsored by the SMTA, Technology Forecasters and The GoodBye Chain Group.
For details and to register, visit www.smta.org/smtai .
HERNDON, VA — iNEMI’s High-Reliability RoHS Task Force has published process and reliability guidelines for high-reliability electronics that may include both SnPb and Pb-free parts. Reliability concerns arise due to the differences in processing temperatures and materials.
RoHS5 modules (5 of 6 RoHS materials) are products that are RoHS-compliant, but contain Pb (under an applicable RoHS exemption). RoHS6 modules (6 of 6 RoHS materials) are soldered with Pb-free solder and are fully RoHS-compliant and Pb-free.
With current RoHS exemptions for high-reliability electronics, it is possible for assemblies to contain Pb and still be RoHS-compliant. Manufacturers taking the Pb exemption will continue to require SnPb-compatible components for their products, and may also use subassemblies, such as hard disk drives and power modules, that may or may not be Pb-free.
Thilo Sack, principal engineer, corporate technology, for Celestica and co-chair of the iNEMI High-Reliability RoHS Task Force, noted, “If RoHS6 subassemblies are to be used in RoHS5 products, the subassemblies should be thoroughly qualified to ensure that they will meet the higher reliability requirements of the RoHS5 products. Furthermore, in some cases solders and processes should not be mixed. For example, only BGAs with SnPb solder balls should be used in a SnPb assembly process, and only SAC solder balls in a SAC process.”
The task force recommends that Pb-free Sn finishes on leaded and discrete components only be used when these finishes (1) include suitable tin whisker mitigation practices, per IPC/JEDEC JP002, and (2) have passed Class 2 level tin whisker acceptance testing requirements, per JESD-201. For subassembly modules meeting RoHS5 or RoHS6 requirements, plated leads or pins that will be attached to the PCB should be backward compatible with SnPb assembly processes.
The complete guidelines can be downloaded here:
http://thor.inemi.org/webdownload/projects/ese/High-Reliability_RoHS/High_Rel_position_061206.pdf
The task force consists of OEMs and EMS providers with long service life products and high-reliability requirements, including:
Agilent Technologies, Alcatel, Cisco Systems, Celestica, Delphi Electronics & Safety, HP, Intel, Jabil, Lucent, Plexus, Sanmina-SCI and Sun Microsystems.
RoHS5 modules (5 of 6 RoHS materials) are products that are RoHS-compliant, but contain Pb (under an applicable RoHS exemption). RoHS6 modules (6 of 6 RoHS materials) are soldered with Pb-free solder and are fully RoHS-compliant and Pb-free.
With current RoHS exemptions for high-reliability electronics, it is possible for assemblies to contain Pb and still be RoHS-compliant. Manufacturers taking the Pb exemption will continue to require SnPb-compatible components for their products, and may also use subassemblies, such as hard disk drives and power modules, that may or may not be Pb-free.
Thilo Sack, principal engineer, corporate technology, for Celestica and co-chair of the iNEMI High-Reliability RoHS Task Force, noted, “If RoHS6 subassemblies are to be used in RoHS5 products, the subassemblies should be thoroughly qualified to ensure that they will meet the higher reliability requirements of the RoHS5 products. Furthermore, in some cases solders and processes should not be mixed. For example, only BGAs with SnPb solder balls should be used in a SnPb assembly process, and only SAC solder balls in a SAC process.”
The task force recommends that Pb-free Sn finishes on leaded and discrete components only be used when these finishes (1) include suitable tin whisker mitigation practices, per IPC/JEDEC JP002, and (2) have passed Class 2 level tin whisker acceptance testing requirements, per JESD-201. For subassembly modules meeting RoHS5 or RoHS6 requirements, plated leads or pins that will be attached to the PCB should be backward compatible with SnPb assembly processes.
The complete guidelines can be downloaded here:
http://thor.inemi.org/webdownload/projects/ese/High-Reliability_RoHS/High_Rel_position_061206.pdf
The task force consists of OEMs and EMS providers with long service life products and high-reliability requirements, including:
Agilent Technologies, Alcatel, Cisco Systems, Celestica, Delphi Electronics & Safety, HP, Intel, Jabil, Lucent, Plexus, Sanmina-SCI and Sun Microsystems.
Press Releases
- Federal Electronics Expands Advanced Manufacturing Capabilities with New Class 10,000 Cleanroom
- Absolute EMS: Leading the Way in High-Technology Electronics Manufacturing with Local Support for NPI, R&D, and Mid-Volume Production
- Jabil Recognizes Nordson Electronics Solutions with the 2024 Best Strategic Supplier Award
- Dr. Jennie Hwang to Deliver 2 PDCs on “Artificial Intelligence Era – Opportunities, Challenges, Possibilities” and “High Reliability Electronics for Harsh Environments” at IPC Apex