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SAN JOSE -- Verigy Pte. Ltd., the ATE branch of Agilent which is on track to be spun off,  will outsource its manufacturing to Flextronics beginning later this year.

The plan was detailed in a S-1 filing required as part of Verigy's proposed initial public offering.
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NEW YORK -- IBM has signed a long-term contract with Solectron Corp. to manage billions of dollars in indirect procurement services across 17 countries. Other terms of the contract were not disclosed.

Under the contract, IBM will manage more than $1.2 billion per year of indirect spend for temporary contract services, office equipment, utilities and telecommunications. IBM will integrate its procurement software with Solectron's internal systems and controls.

IBM will enable Web-based requisitioning as well as efficient procurement and supplier payment.

"The savings we expect from this contract with IBM will contribute to both operational and process innovation and simplification, which improves services to our customers and suppliers," says Perry Mulligan, chief procurement officer, Solectron, in a prepared statement.

IBM will supply commodity experts, a global contact center and an accounts payable processing center supporting Solectron suppliers and employees around the globe. Solectron will also have access to a full range of transformation and maintenance services from IBM.
SAN JOSE -- The Semiconductor Industry Association today launched a new website on America’s competitiveness. The site is the latest in a series of activities designed to focus attention on steps to take to ensure American leadership in innovation and technology.

The site, located at www.choosetocompete.org, details the industry’s importance to the everyday life of Americans and the need for public policies that foster a competitive economic environment for Information Technology industries.

“For more than 50 years, America has been the world leader in innovation and technology,” said SIA president George Scalise. “Leadership in innovation and technology has been essential to continuous improvements in the U.S. standard of living, increased productivity and higher wages for American workers, and ensuring national security. Today other nations are working very hard to replicate our model for success. This Website presents a series of broadly supported public policy initiatives designed to meet the new global competitive challenge and secure America’s leadership in technology and innovation.”

The site includes information showing the importance of increased federal support for basic research at U.S. universities, updated education and immigration policies that will allow American companies to maintain employment within its borders, and economic policies that enhance the climate for investment in high-tech facilities for manufacturing, research and development, and product design.

Other areas of the site provide information on critical applications of chip technology – from agriculture to medical science and national defense. The site also features news updates on the growing momentum for action on bipartisan proposals on American competitiveness, information on proposed legislation and links to partner Websites.

In April SIA will add an interactive tool outlining the key points in the modern technology timeline, illustrating the critical role of semiconductors in a broad range of applications, and presenting the challenges now faced by America’s technology sector.
Rome, NY – The ESD Association has scheduled an ESD Device/Design Seminar to be held at its Rome headquarters May 1-2. Developed by the ESDA’s Professional Education Committee, the technical seminar will cover on-chip ESD protection designs.
 
The seminar will focus on: ESD in the industrial semiconductor IC context; ESD models and ESD testing; ESD device operation; ESD circuit operation; technology impact on ESD design choices; special circuit requirements, including RF, and their impact on ESD; CDM ESD protection; and design examples and case studies.
 
The course is required for ESD Certified Professional-Device/Design certification.
 
Instructors are Charvaka Duvvury, Ph.D., Texas Instruments, and James W. Miller, Freescale.
 
For more information, visit esda.org/documents/DeviceDesignSeminar-2006_Rome.pdf
SEATTLE -- Microsoft has delayed -- again -- the launch of its Windows Vista operating system, pushing out the next generation software for PC consumers to January 2007. Business customers will get in the door a couple months earlier, in November.

Analysts are mixed on whether the delay will impact overall PC sales, but the consensus is that buyers will wait the extra few months for the new OS. Thus, fourth quarter shipments might not be as robust as previously forecast.  Read more ...

HERNDON, VARegistrations for iNEMI’s April 5 roadmap workshop are due March 28, the consortium said today.

The full-day meeting, co-sponsored by Fraunhofer IZM, IEEE’s CPMT (Components, Packaging and Manufacturing Technology) Society and IMAPS Europe, takes place at the ICM Congress Hall at Munich Messe. 

It coincides with SemiCon Europa, also in Munich.

The workshop will give attendees an advance review of draft chapters of the 2007 iNEMI Roadmap, including two key market segments and eight of the 19 technology and infrastructure areas covered:

Product sectors include automotive products and consumer/portable products. Technology areas include Packaging, board assembly, organic substrates, ceramic substrates, sensors, test, inspection and measurement, final assembly and environmentally conscious electronics.

Attendees' input be be incorporated in the 2007 Roadmap.

The registration fee is $200 and includes a copy of the 2007 iNEMI Roadmap CD. Registration deadline is March 28.  For information click here.

For information about SemiCon Europa, click here.

Every two years iNEMI updates its compendium of future manufacturing technology needs of the global electronics industry. The roadmap has become recognized as an important tool for defining the state of the art in electronics as well as identifying emerging and disruptive technologies. 


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