News
Norcross, GA, March 23 -- The Electronics Assembly Systems Division of Siemens Logistics and Assembly Systems Inc. is providing SMT Process training on April 18-22, in partnership with the Center for Electronics Manufacturing & Assembly (CEMA) at Rochester Institute of Technology, (RIT).
The training will take place at RIT's CEMA facility in New York. It features a fully equipped SMT Laboratory, which includes screen printing, dispensing, pick-and-place, reflow, rework stations, optoelectronics workstations, wire bonding, test and inspection equipment.
The hands-on course provides participants with a thorough understanding of SMT and advanced packaging principles needed for supporting and troubleshooting the SMT process. It will offer discussions on process parameters and process characteristics, paste qualification including lead-free solder compounds, as well as identifying and correcting defects.
The course is offered as a result of the Siemens Electronics Consortium for the Advancement of Electronics Manufacturing Education (CAEME).
Using a patented off-center tomosynthesis imaging technique, ClearVue is suited for densely packed single- or double-sided boards that use BGA-style components, or when loss of electrical or optical access is problematic.
Compared to laminography and other 3-D x-ray techniques, the technology reportedly provides superior image clarity, diagnostic capabilities and full board coverage to expose solder (including lead-free) flaws that are otherwise overlooked.
Operates using a stationary x-ray source and detector and, unlike conventional systems, does not require complex or rotating mechanical parts. Said to result in lower false call rates (promising up to 40 times improvement over existing solutions), improved reliability, better repeatability and improved cycle times.
FRANKLIN, MA- SMT knowledge experts from Speedline Technologies
will lead a free, one-hour Webcast seminar on April 14 to answer
questions engineers need to consider before implementing lead-free
reflow soldering processes on their manufacturing floor.
The Webcast, scheduled from 11 a.m. to Noon, EST, will feature live discussions of process challenges, new technologies, how-to implementation information and participant questions. Topics include:
Required equipment and process changes; Details to consider in optimizing the lead-free process; Reflow equipment configurations and differences; Producing lead-free assemblies; Nitrogen process variables; Cooling considerations; Cost of operation.
For more information, visit: speedlinetech.com/seminars.
Sanders is a former general manager and site executive for
the Defense & Space Electronics Systems division of Honeywell.
Sypris Electronics is a contract desginer and assembler of missile
guidance systems, and gear and satellite communication systems.
MINNEAPOLIS -- Connecticut area designers and engineers are sought for the Connecticut chapter of the SMTA.
A new leadership team is being established for the Nutmeg (Connecticut) chapter and will be planning meetings for 2005. The group will meet in April. Those interested in serving on the leadership team should contact Gayle Jackson at SMTA, gayle@smta.org.
Jackson is also accepting input on technical topics for upcoming meetings.
The next chapter meeting will be held in May; visit www.smta.org for details.The companies' experience in soldering technology (both leaded and lead-free) can help industry companies become compliant with the RoHS directives. The seminar is designed to assist companies in transitioning reliably without false starts. The series brings together the information that will save companies many engineering hours of research and will give what is needed to achieve lead-free and RoHS compliancy rapidly.
Topics include: lead-free and RoHS directive overview; impact to a company's operations; impact of dual systems, leaded and lead-free; boards and RoHS requirements; components and RoHS requirements; lead-free soldering and alloy selection; surface finish changes and solderability; equipment changes and process modifications; optimizing the wave solder operation; BGA rework practices; hand soldering and rework production issues; preventing soldering defects with lead-free; contamination controls; training and documentation with lead-free; field service issues with lead-free; and finished assembly identification and traceability.
Lunch and refreshments will be provided. Attendees will receive a lead-free assembly technical manual and detailed white papers; a subscription to the Lead-Free Connection Newsletter; and valuable process information and technical tips to achieve solid lead-free processes.
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