GLASSBORO, NJ -- Essemtec (essemtec.com), an SMT production equipment manufacturer, will be one of the exhibitors at the 9th Annual SMTA Atlanta Expo, scheduled for April 21 at the Gwinnett Center in Duluth, GA.
The company, represented in the Circuit Technology Inc. booth, will showcase its pick-and-place machine with dispenser.
In 1997, the Surfact Mount Technology Association (smta.org) offered its first tabletop Vendor Day at several chapter locations and has continued to hold new and annual Vendor Days. The one-day events are popular among industry suppliers. The Atlanta Expo will take place from 10 a.m. until 4 p.m., and will offer six free technical sessions on lead-free and other topics.
The mini peak season for air freight that started in early March -- and then built momentum -- is expected to continue through the end of April. To date, all regions of Asia and the Indian Subcontinent have experienced strong demand for airlift, rate pressure from carriers and longer transit times, according to Hong Kong-based Trans Global Logistics (www.tglogistics.net).
Many origin gateways that had adequate space to meet demand have had to contend with cargo backlogs at transit hubs. The greatest rate pressure has been felt in Hong Kong, Shanghai and Taiwan.
Bannockburn, IL -- Four new committee members have been elected to the IPC SMEMA (Surface Mount Equipment Manufacturers Association) Council Steering Committee.
The following were elected to three-year terms: Alec Babiarz, senior vice president, Asymtek; Robert Muller, general manager commercial products, Teradyne Assembly Test Division; Marc Peo, president, Heller Industries; and Jay Stepleton, general manager and vice president, Agilent Technologies Manufacturing Test Business Unit.
Pierre de Villeméjane, president of Speedline Technologies and the new chairman-elect, will begin his term at Apex 2006. Gerhard Meese, executive VP of Dover Technologies, currently serves as steering committee chairman and representative to the IPC Board of Directors.
The committee sets the agenda for the SMEMA Council and creates other initiatives to improve supply chain efficiencies in the electronics manufacturing industry. It also organizes the Apex show.
According to a recently released report, XRD measurement correlates to measured compressive residual stress on coatings with whisker growth. Three coatings with high compressive residual stress also exhibited whiskering. However, the coatings evaluated were all at least twice as thick as penetration depth of the XRD measurement system, and the measured compressive residual stress values did not start to increase until after the formation of tin whiskers. However, the XRD method did provide some correlation between residual stress in the coatings and the extent of whisker growth.
The findings were released as a part of the National Physical Laboratory's Phase 2 Studio Project to understand tin whiskers.
For more information contact Dr. Chris Hunt: Lchris.hunt@npl.co.uk.