The x-ray group offers manual and automated inspection systems; the rework group manufactures semiautomated and automated rework systems for microBGA, CSP and flip-chip component technologies, including lead-free processing.
The facility is located at 1000 Mount Laurel Circle, Shirley, MA 01464; (978) 425-9446.
The paste reportedly features a stable performance down to 70 µm bump heights (corresponding to 135 µm bump pitches) for a consistent printing process. The stable printing provides consistency of bump height across the wafer as well as from wafer to wafer.
It will operate as part of the newly-expanded COMET China office.
Friedhelm Maur, regional sales manager, and Zoran Zecevic, service engineer, have relocated to Shanghai from the global headquarters in Garbsen, Germany.
Speakers from government and industry will discuss export control requirements related to China and explore what exporters and Chinese customers need to do to meet these requirements and ensure export compliance.
For more information, contact Maggie Hershey: mhershey@semi.org.
The paper is available from SEMI. Go to www.semi.org/ehs and click on "European Union's WEEE and RoHS Directives."