ALPHA OM-338 PT lead-free no-clean solder paste is said to offer unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.
 
“Lead-free pastes have an inherent difficulty with pin test yields… [but] OM-338 PT has proven to be a very promising innovation,” said Mitch Holtzer, global product manager. “Alpha OM-338 PT is targeted to both EMS and OEM customers using in-line circuit testing. It was developed to reduce the number of false negatives recorded when pin probes are used, resulting in increased throughput and yield.”
 
In addition to excellent pintestability with virtually no residue on pins, it offers high print speeds (up to 150 mm/sec., on 12 mil squares and 10 mil circles), compatibility with both Rheopump and Pro-Flow, electrical reliability (passes IPC, Bellcore and HP requirements), clear, colorless flux residue yielding excellent joint appearance, and low voiding and anti-slumping characteristics.
 
Cookson Electronics, newalphaproducts.com

BP Microsystems will highlight the Helix, the latest addition to its automated device programmer family, at the upcoming SMT/Hybrid/Packaging exhibition in Nuremberg, Germany. Also on display: ISP-PRO socket module and manual programming systems.

The Helix desktop automated system comes with two precision-designed tube input and output handling systems. Integrated in the handler are two 7^th Generation programming sites with FX socket module capability. This allows for programming up to four devices simultaneously per site. Can handle MSOP, SOIC, PLCC, SSOP and TSSOP. A tray-only version will be available at a later date. 
 
ISP-PRO socket module was designed to provide in-circuit programming solutions. Manual programmers can be connected to the board via a cable interface using the socket module.
 
The latest manual device programmers feature high-speed USB 2.0 standard bus for improved communication speed.
 
BP Microsystems, bpmicro.com
SMT/Hybrid/Packaging Hall 9, Stand 9-532
 

ESSEMTEC will display the HLX Series, a high-performance placement system series for flexible SMT manufacturing at SMT/Hybrid/Packaging on May 30 to June 1.
 
The series features production speeds up to 22,000 cph and a large feeder capacity (192 tape and stick feeders). 16 JEDEC trays can be used without loss of any feeder space. The series is comprised of the HLX8100 and HLX8200. Can be changed over during operation-- without standstill. On-the-fly setup modification ensures maximum machine load even with small productions series. Linear drives are maintenance-free, fast and precise. They position the placement heads precisely in the x- and y-axes. During placement, the board is fixed.
 
“Collect & Place” method enables high-placement performance. HLX8100 comes with one placement head with four vacuum nozzles and HLX8200 has two placement heads with a total of eight nozzles working in parallel. Cognex Vision (SMD4) enables precise, fast alignment, and checking of components. With transparent lighting, illumination is independent of component type and image analysis is reliable.
 
All feeders are exchangeable and refillable during operation. The systems are optimized immediately after every feeder change.
 
Are laid out for rugged, long-term operation at three-shift workdays. The chassis and wear-resistant linear drives allow for high acceleration of placement heads. The gantry system permits the simultaneous operation of two placement heads in parallel. While one head retrieves four components, the other uses this time slot for placement.
 
 
ESSEMTEC, essemtec.com
SMT/Hybrid/Packaging Hall 7, Stand 203

VacuNest Shape Memory Tooling combines the benefits of a custom tooling plate with the versatility of pins. An antistatic membrane covers a foam former surrounded by polymer granules. Place a golden board onto the modules, press down, pull a vacuum and the memory of the board shape profile is held. The chambers are profiled to the shape of the underside of the board ¾ on activation of the vacuum this shape is now held. Simple, secure and a custom board support is created within seconds. The shape will be held for weeks/days/months until the vacuum is released, whereupon the modules return to their original form, awaiting a new set up for the next version of board.
 
Advantages include: no risk damage to a component due to the pin/printing pressure, support forces evenly spread over the entire board, firm and precise support, ease of use, no dedicated tooling and short payback period, and the tool can be simply reset when a board version changes.
 
 
Can handle high-density boards and requires little to no lead-time.
 
Applys firm force consistently to the entire board. Guarantees board flatness and is not sensitive to solder paste contamination.
 
Novatec, novatec-eap.com
Booth 8-207