Samtec mPOWER ultra micro connector system, now available with through-hole PCB termination options, is designed for enhanced mechanical strength and reliability in industrial, military, and aerospace applications. Available for UMPS and UMPT vertical board connectors and UMPT-RA right-angle board connectors. Supports up to 18A per power blade while reducing board space requirements by 40% compared with conventional power connectors. Supports board-to-board, wire-to-board, and wire-to-wire applications with vertical and right-angle configurations, stack heights from 5mm to 20mm, rugged latching features, and 2 to 10 power positions. PVC and Teflon fluoropolymer cable assembly options available in multiple wire gauges.

Tagarno relaunched its Full HD digital microscope line with updated configurations, revised model structure and a new camera system for inspection applications. Now centers on the ZIP+, ZAP+, and TREND+ models, with MOVE and FRONT integrated as configurations within the ZAP+ platform and the Prestige model discontinued. The microscopes incorporate a Sony FCB-EV9520L camera, providing improved dynamic range, reduced image noise,and updated color reproduction for inspection of reflective and fine-detail surfaces such as solder joints. Supports simultaneous zoom and focus adjustments, along with faster image processing for navigation and inspection tasks.

Low-silver wire solder series supports manual and automated soldering applications with reduced silver dependency. The system features 0.1–0.3% Ag content and anti-iron tip erosion properties to extend soldering tip life. Designed to support improved wettability and solder flow, with reduced bridging under challenging conditions. Flux system enables consistent coverage with residues designed for simplified cleaning. Suitable for robotic soldering applications and integration into automated assembly processes. Intended for electronics manufacturing environments seeking cost control while maintaining process stability.

Low-silver solder paste series supports SMT assembly with reduced material cost exposure while maintaining process compatibility. The system features ~0.1–1.1% Ag content compared to ~3.0% in SAC305, enabling lower silver usage. Designed for compatibility with standard SAC305 reflow profiles, minimizing requalification requirements in existing processes. Supports stable wetting performance and controlled voiding behavior, with reliability validated through thermal cycling and mechanical testing. Intended for cost-sensitive SMT applications requiring consistent process performance and long-term reliability.