News
Products
Takaya APT-2400F/APT-2600FD Series flying probe, for inspection of high-density circuit boards, has a unique control mechanism and sensing technology and user-friendly interface said to reduce the load and improving operator efficiency.
Shenamo PF925 near-eutectic solder is said to improve mechanical strength, thermal stress resistance, and defect prevention in high-reliability electronics.
Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.
Cybord Real-Time Interception (RTI) visual AI-powered software is said to prevent defective components from being assembled on printed circuit board assemblies (PCBAs) in real time.
Panasonic Connect NPM-GW modular placement machine features real-time monitoring, predictive maintenance, and enhanced versatility in component handling.
Accu-Assembly AccuCart Smart Rack for Feeders manages feeder management and inventory tracking in surface mount technology (SMT) assembly environments.
Press Releases
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Pushed by glass core and high-end ICs substrates for AI, the advanced IC substrate market reaches $31 billion by 2030
- Ryder Vietnam - Phase 2: Building resilience and meeting demand
- Scanfil and Etteplan deepen their strategic partnership into production testing