Telit Cinterion has announced deviceWISE Intelligence Suite, a platform designed to bring AI-powered autonomous control to the factory floor. The suite enables intelligent agents to autonomously observe, analyze and act across every machine, sensor and workflow. Integrating with PLCs, robots, CNCs and enterprise systems, the platform supports use cases including fault detection, workflow guidance, process insights and real-time information retrieval. It also introduces self-mapping factory capabilities, anomaly detection without manual training, and MCP server/client functionality for multi-agent coordination. The suite will be available in January.

Yincae Advanced Materials has launched UF 66L, a next-generation Optical Clear Underfill (OCU) designed for silicon photonics, optoelectronic packaging, image sensors, AR/VR modules and advanced flip-chip assemblies. Engineered to deliver both high transparency and thermal endurance, UF 66L withstands five reflow cycles at 260 °C without cracking, delamination or adhesion loss. It maintains over 95% light transmittance between 400–800 nm, ensuring minimal signal loss in optical pathways, while its non-yellowing stability preserves clarity even after repeated high-temperature exposure. The material offers excellent adhesion to silicon, glass and substrates. Formulated with a controlled modulus that reinforces delicate structures while minimizing stress and warpage, addressing the limitations of conventional epoxy underfills that degrade under thermal cycling. It is optimized for optical interconnect stability, waveguide coupling, photodetectors and other high-density optoelectronic packaging scenarios.

Yamaha Robotics SMT Section has released an upgraded version of YSUP-PG, its program generator designed to accelerate new product introduction (NPI) for surface-mount lines. Features an enhanced user interface and advanced automation that streamlines data conversion from popular EDA formats such as ODB++, enabling faster generation of mounter and inspection programs. Real-time component-placement image updates, clickable task lists and automated workflows. Enables AOI libraries to be created directly from CAD data, allowing mounter and inspection programs to be developed in parallel. Enhanced Gerber image and CAM conversion tools produce accurate simulated board images, with built-in compositing that automatically calculates PCB layer images. By combining Gerber and CAD data, the software digitally determines push-up pin positions.

Seika Machinery's Nippon Nozzle division supplies precision spinnerets, spunlace jetstrips, film dies and inspection systems to North American manufacturers. Known for machining tolerances down to ±0.001 mm. The product line includes wet, dry, air-gap and melt spinnerets; hydroentanglement jetstrips; tailored film extrusion nozzles; and ultrasonic cleaning and automated measurement systems. All components are produced through in-house alloy melting, precision machining, polishing and inspection to ensure consistent fiber and film flow.