PF606-P266J is a solder paste developed for high-speed jet dispensing applications in advanced electronics manufacturing. Designed for non-contact solder deposition. The formulation meant to maintain process stability across a broad range of jetting parameters. The solder paste uses a halogen-free flux system that supports strong wetting behavior and low residue levels. PF606-P266J supports ultra-fine solder powders from Type 5 through Type 7. The product is available in multiple alloy options, including SAC305, high-reliability alloys for automotive and industrial electronics and low-temperature alloys.

The VALID SL in-circuit and functional test system is designed for high-channel-count testing in demanding electronics manufacturing environments. Introduces a cable-free architecture with new 128-channel scanner cards, supporting configurations exceeding 4,480 channels for complex test requirements. Offers an expanded test area with both single-stage and dual-stage configurations and supports multi-job operation through Seica’s latest VIVA software interface. Integrates streamlined internal hardware access. Built to support scalable automation and intelligent test strategies for high-volume and high-reliability applications.

The VT171P single-channel and VT172U dual-channel transmissive sensors are surface-mount devices designed for position sensing in industrial, consumer and telecom applications. Housed in a 5.5mm × 4mm × 5.7mm package with a 42% increased dome height compared to previous-generation industrial devices. Supports greater mechanical design flexibility and increased vertical clearance for large code wheels in turn-and-push applications. Both devices integrate an infrared emitter with phototransistor detection and operate at a wavelength of 950nm. Deliver a typical output current of 1.5mA with a 3mm gap width, 0.3mm apertures, and rise and fall times of 14ms and 21ms. The VT172U adds dual-channel detection for direction sensing, while both devices support motion and speed detection for encoders, automation systems, consumer electronics, appliances, health and care devices, switches, relays, antennas, and mobile broadband equipment. 

The InoHD ultra-high-density smart storage system is designed to maximize SMT and electronic component storage while reducing factory floor space requirements. Eliminates traditional storage aisles by combining servo-driven mobile shelving with smart sensing and pick-to-light guidance. Supports storage densities of up to 310 SMT reels per square foot while maintaining guided access and real-time inventory verification. The system enables direct point-of-use material access with built-in verification to reduce picking errors. Accommodates more than 10,500 SMT reels within a 4ft × 8ft footprint, supporting space reduction compared with conventional stockroom layouts. Modular and scalable architecture designed for integration with existing MES and ERP platforms to reduce labor time and unnecessary material handling.