Loctite 3629 is a low-temperature cure epoxy adhesive suited for high-speed dispensing on a range of standard machines, including ProFlow cassettes for printing.

 

Has been successfully tested in lead free production environments. Low-temperature cure requirement makes it ideal for applications where heat sensitive materials need to be bonded prior to wave soldering.  Lower oven temperatures also reduce energy use.

 

Meets on-board reliability testing standards, suitable for use on PCBs in high reliability equipment used in harsh operating environments.

 

Unique color makes visual inspection easy; uncured adhesive is fluorescent under UV light.

 

Available in a range of syringes and cassettes.

 

Henkel, henkel.com/electronics

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RFID Smart Feeder validation system is reportedly robust and flexible enough for all machine types. Can be retrofitted to existing placement machines. Enables closed-loop feeder and component setup validation; eliminates human errors and reduces changeover time; provides real-time material inventory, traceability and feeder slot scans.

 

Integrates with feeder setup verification software from third-party suppliers to eliminate manual barcode scanning.

 

Cogiscan, cogiscan.com

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1072 VOC-Free rosin flux is both halide- and VOC-free. The new chemistry combines the benefits of rosin with the environmentally friendliness of a water-based product.

 

Specifically developed for wave soldering of surface-mount, mixed-technology and through-hole electronic assemblies. Water-based nonflammable formulation eliminates special storage requirements.  Said to offer solderability on difficult-to-solder assemblies and a wide process window.

Indium Corp. of America, indium.com

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PALO ALTO and MOUNTAIN VIEW, CA, Dec. 14, 2004 -- Agilent Technologies Inc. and Synopsys Inc. have introduced a scan diagnostics reference methodology that speeds fault localization and failure analysis for semiconductor design and test engineers, the result of a three-year strategic alliance.

 

The methodology is enabled by the Agilent 93000 SmarTest Program Generator (PG) 2.2 and the Synopsys TetraMAX automatic test pattern generation (ATPG) solution, in conjunction with the Agilent 93000 SOC Series test platform. The tools automate the bidirectional information sharing between electronic design automation (EDA) and automatic test equipment (ATE) required for scan diagnostics.

 

As process geometries shrink and device complexity grows, identifying device failures becomes increasingly difficult. The demand for shorter time to market and lower product cost makes rapid diagnostics and fault localization vital during the first silicon evaluation and production ramp up. EDA companies have begun to offer fault localization tools, but they require failure information from automatic test equipment. Until now, a standardized and supported means for sharing information from ATE has not been available.

 

The SmarTest PG 2.2 offers a transition from the EDA environment to the capabilities of the 93000 SOC Series, which speeds test development for functional and scan tests. SmarTest PG 2.2 provides a scan failure map on the SOC Series in their native scan context, speeding first silicon debug. Features a simplified user interface and command-line operation, and supports industry-standard EDA input formats, including Standard Test Interface Language (STIL), Waveform Generation Language (WGL), Value Change Dump (VCD), Extended VCD (EVCD) and Core Test Language (CTL).

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