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AUSTIN, TX – The growth of flip chip and wafer level packaging is a bright spot in the industry, says researcher TechSearch International. The firm projects a compound growth rate of more than 14% for flip chip units and 14% for WLPs between 2007 and 2012.
The drivers for flip chip continue to be performance and form factor. The use of flip chip for a variety of wireless products will contribute to the growth in 2009. An increasing number of suppliers of ASICs, field programmable gate arrays, DSPs, chipsets, graphics and microprocessors are expanding use of flip chip with solder bumps and copper pillars in package. Flip-chip-on-board continues to be found in automotive electronics, hard disk drives and watch modules. Many companies are planning to use micro bumps through silicon via products, according to TechSearch.
The growth in WLPs is driven by increased demand for thinner, lighter-weight portable products, but WLPs are adopted for both form factor and performance reasons. WLPs have typically been used for low pin count (≤50 I/O) small die size applications, including analog devices such as power amplifiers and battery management devices, MOSFETs, image sensors, controllers and integrated passives. However, WLPs are now an option for larger die sizes with higher pin counts (≥100 I/O), says the firm.
The drivers for flip chip continue to be performance and form factor. The use of flip chip for a variety of wireless products will contribute to the growth in 2009. An increasing number of suppliers of ASICs, field programmable gate arrays, DSPs, chipsets, graphics and microprocessors are expanding use of flip chip with solder bumps and copper pillars in package. Flip-chip-on-board continues to be found in automotive electronics, hard disk drives and watch modules. Many companies are planning to use micro bumps through silicon via products, according to TechSearch.
The growth in WLPs is driven by increased demand for thinner, lighter-weight portable products, but WLPs are adopted for both form factor and performance reasons. WLPs have typically been used for low pin count (≤50 I/O) small die size applications, including analog devices such as power amplifiers and battery management devices, MOSFETs, image sensors, controllers and integrated passives. However, WLPs are now an option for larger die sizes with higher pin counts (≥100 I/O), says the firm.
Gold bump demand continues to be dominated by LCD driver ICs, but die shrink has limited the growth in number of wafers. An increasing number of gold stud bumped devices are also shipping.
SHANGHAI – Trace Laboratories has opened a
testing laboratory in Shanghai.
The lab supports material analysis, functionality, design validation, dimensional measurements and process validation testing. Trace sees the new facility as an “important step in assisting customers with their product validation in a timely fashion.”
The lab is in a high-growth market, with production geared for the global marketplace. Trace believes this will save its customers time and money by removing the need to ship products prior to qualification.
The lab supports material analysis, functionality, design validation, dimensional measurements and process validation testing. Trace sees the new facility as an “important step in assisting customers with their product validation in a timely fashion.”
The lab is in a high-growth market, with production geared for the global marketplace. Trace believes this will save its customers time and money by removing the need to ship products prior to qualification.
TAIPEI – Taiwan Union Technology Corp. this week responded to a competitor’s allegations of patent infringement with a stern denial.
In a statement, TUC demanded Isola USA Corp. immediately retract its allegations and related legal procedures and “stop harassing TUC customers and interested companies at once.”
Last week, Isola alleged that TUC product numbers TU-662 and TU-752 infringe China patent no. 123529.
“TUC believes that Isola’s allegation of patent infringement is groundless,” TUC said in a press statement. Extensive testing show the composition of TU-662 and TU-752 laminates by TUC and outside experts and scholars are outside of the scope of the patent, the company asserted.
On advice of its legal counsel, TUC declined to disclose the name of the outside testing facilities, the company told PCD&F, a sister publication of CIRCUITS ASSEMBLY.
The company further stated it would will take “all available legal actions” to protect it from damages to its business and reputation.
Isola also filed claims against ITEQ; that company has not publicly responded.
Key words: laminate
WASHINGTON, DC – TechNet, the bipartisan political network of CEOs that promotes the growth of the innovation economy, today urged Congress to approve the economic rescue package now under consideration.
"We urge Congress to approve the economic rescue package now before the Senate," said Lezlee Westine, president and CEO of TechNet. "Not only is the bill essential to stabilizing our nation's economy, but it also includes vitally important tax incentives for clean energy and research and development that can help create thousands of high skilled jobs in America.
"We strongly believe the financial package before Congress is far too important to the stability of our economy to let fail," said Westine in a press release. "This measure is not just for financial services, and if no action is taken will hurt businesses across every sector because we are all affected by problems in the credit markets. The ramifications would quickly boomerang throughout the whole US economy and we simply cannot let that happen."
EL SEGUNDO, CA – PC demand continues to defy economic and financial woes, with second-quarter worldwide unit shipments growing 14.5% year-over-year to reach 70.2 million units. No changes occurred sequentially among the top five OEM rankings, says iSuppli Corp.
Overall PC shipments came in higher than forecast, said Matthew Wilkins, principal analyst, compute platforms for iSuppli. “iSuppli maintains its enthusiasm for the PC market in 2008, despite the challenging conditions. iSuppli’s latest forecast for the 2008 PC market estimates unit growth of 12.5%.”
“Hewlett-Packard continued its impressive start to 2008, with shipments of 13.4 million units, maintaining its worldwide No. 1 ranking at a share of 19.1%,” Wilkins said. “However, the second quarter represented Dell’s fourth consecutive quarter of market share growth, with the company delivering shipments of 11.2 million units and a share of 16%.”
Acer and Lenovo continued their fierce scrap, although with no change in rank, says the firm. Acer held onto third place with a 9.5% share, and Lenovo maintained fourth place, with a 7.9% share.
Lenovo proved Dell wasn’t the only top five OEM that could grow share, delivering a 1% sequential increase in share to reach 7.9%.
The second quarter was the fourth consecutive quarter during which Dell gained market share, noted iSuppli.
Overall PC shipments came in higher than forecast, said Matthew Wilkins, principal analyst, compute platforms for iSuppli. “iSuppli maintains its enthusiasm for the PC market in 2008, despite the challenging conditions. iSuppli’s latest forecast for the 2008 PC market estimates unit growth of 12.5%.”
“Hewlett-Packard continued its impressive start to 2008, with shipments of 13.4 million units, maintaining its worldwide No. 1 ranking at a share of 19.1%,” Wilkins said. “However, the second quarter represented Dell’s fourth consecutive quarter of market share growth, with the company delivering shipments of 11.2 million units and a share of 16%.”
Acer and Lenovo continued their fierce scrap, although with no change in rank, says the firm. Acer held onto third place with a 9.5% share, and Lenovo maintained fourth place, with a 7.9% share.
Lenovo proved Dell wasn’t the only top five OEM that could grow share, delivering a 1% sequential increase in share to reach 7.9%.
The second quarter was the fourth consecutive quarter during which Dell gained market share, noted iSuppli.
MORRISVILLE, NC – Juki Corp., a provider of automated assembly lines, closed the third quarter with record growth of more than 35% year-over-year.
Sales of surface mount placement systems grew nearly 40%, complemented by more than 20% growth in the selective solder line.
Juki reported the strong start of the FX-3 high-speed placement system was a major factor in 2008 sales.
Sales of surface mount placement systems grew nearly 40%, complemented by more than 20% growth in the selective solder line.
Juki reported the strong start of the FX-3 high-speed placement system was a major factor in 2008 sales.
Press Releases
- ZESTRON Hosts Webinar on “Electronic Assembly Failures, Solutions and Lessons Learned for Long Term Reliability”
- Surface-Mount Innovations Delivering More for Less
- Freemelt to Outsource Production to Scanfil
- TAGARNO and Comtree to Host Live Webinar on Digital Microscopes in Canadian Electronics Manufacturing; Jake Kurth Comments