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PHILADELPHIA – The American Competitiveness Institute will sponsor a free electronics adhesives workshop on July 11, in Philadelphia.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
EINDHOVEN, THE NETHERLANDS – The Holst Centre has inaugurated its roll-to-roll line for printed electronics.
SAN JOSE – North America-based manufacturers of semiconductor equipment posted $1.03 billion in orders in May, down 5% sequentially, and down 37% year-over-year, SEMI reported.
SHENZHEN – Privately held Huawei Technologies, China's largest communications network equipment maker, is contemplating the sale of a majority stake in its handsets and terminal operations, according to published reports.
The firm reportedly has sent proposals to Bain Capital LLC, Blackstone Group LP, TPG Inc., Kohlberg Kravis Roberts & Co., Warburg Pincus LLC, Carlyle Group, and other private equity firms.
The company has set a deadline of June 23 for bids, and has appointed Morgan Stanley to manage a possible sale, say reports.
The funds would aid in the investment in Huawei’s routers and other network gear.
Research firm BDA China Ltd. estimates the firm doubled its revenue last year to $2.6 billion. The handset division is said to have taken in profits of $400 million during this same period. Sales for the division were 16.4% of the company’s total revenue in 2007, up from 11.8% in the prior year, according to BDA.
SMYRNA, GA – UP Media Group Inc., parent company of Circuits Assembly and Printed Circuit Design & Fab, today announced registration is now open for PCB West 2008, scheduled for Sept. 14-19, at the Santa Clara Marriott in Santa Clara, CA.
SHERWOOD, OR – Ascentec Engineering has acquired Datum Dynamics USA for an undisclosed sum.
Portsmouth, RI-based Datum will move to Ascentec’s Fitchburg, MA site. Colin Reddy, previously sales manager at Datum, will help transition current Datum clients.
Ascentec designs and manufactures PCBA process tooling.
Datum is a PCB assembly tooling and fixtures supplier in the Northeastern U.S.
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