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SAN JOSE – Dr. Luke P. Lee will describe a new 3-D optical lithography for waveguides self-assembly in the MEMS Packaging Symposium keynote next month.
In the presentation, Lee, a professor in the University of California Berkeley department of Bioengineering, will reveal the process, which uses self-aligned microlenses and self-writing in photopolymers.
His talk takes place May 22 in San Jose.
After the keynote, Karen Lightman, managing director, MEMS Industry Group, will present findings and recommendations from the MEMS Industry Group members’ annual meeting.
Symposium segments include consumer, automotive, biomedicine, and WLPs and 3-D ICs, among others.
To register, visit www.meptec.org.
In the presentation, Lee, a professor in the University of California Berkeley department of Bioengineering, will reveal the process, which uses self-aligned microlenses and self-writing in photopolymers.
His talk takes place May 22 in San Jose.
After the keynote, Karen Lightman, managing director, MEMS Industry Group, will present findings and recommendations from the MEMS Industry Group members’ annual meeting.
Symposium segments include consumer, automotive, biomedicine, and WLPs and 3-D ICs, among others.
To register, visit www.meptec.org.
RICHARDSON, TX – Test Research Inc. will integrate ASSET InterTech’s boundary scan technology into its line of in-circuit testers.
Under the terms of the extended agreement, ASSET will be the preferred supplier of boundary scan systems and related intellectual property to TRI and its customers. No financial terms were disclosed.
Under the terms of the extended agreement, ASSET will be the preferred supplier of boundary scan systems and related intellectual property to TRI and its customers. No financial terms were disclosed.
ATLANTA – After 50 years in electronics, Jim Raby believes the industry’s greatest invention was not the transistor, but the plated through-hole.
The guru of electronics, Raby led what an audience member called a “fireside chat” at yesterday’s Atlanta SMTA Expo. He warmly shared stories from the dawn of the modern electronics industry. Raby, founder of STI Electronics, and a few others brought an Electrovert wave soldering machine from Canada with fake “Made in the USA” stickers on it.
ATLANTA – Lead-free doesn’t seem new, but many myths still pervade industry thinking. One expert tried to dispel them.
In a presentation during the Atlanta SMTA Show Thursday, Chrys Shea, R&D applications engineer manager at Cookson Electronics, posted statements about Pb-free and asked whether the audience thought they were fact or fiction. She made some strong points about the myths of Pb-free, showing a distinct passion for her research. Here are the key points of her presentation:
DANDERYD, SWEDEN – Note AB reported first-quarter sales rose 0.5% to SEK 427.3 million, while net profits fell 53% to SEK 5.7 million.
For the March quarter, the operating profits fell 44% to SEK 13.8 million on a SEK 10 million restructuring charge. The EMS company turned in an operating margin of 3.2%, down from 5.8% last year. Cash flow from operations was SEK 24 million, down from SEK 45.6 million.
During the quarter, Note continued to transfer production to lower-cost countries and cut its headcount in Sweden by more than 150, or roughly 20% of its local workforce. The firm employs 1,200 workers globally.
The company also purchased Nearsourcing Centre in the UK, and acquired a domestic mechanical engineering services group.
For the March quarter, the operating profits fell 44% to SEK 13.8 million on a SEK 10 million restructuring charge. The EMS company turned in an operating margin of 3.2%, down from 5.8% last year. Cash flow from operations was SEK 24 million, down from SEK 45.6 million.
During the quarter, Note continued to transfer production to lower-cost countries and cut its headcount in Sweden by more than 150, or roughly 20% of its local workforce. The firm employs 1,200 workers globally.
The company also purchased Nearsourcing Centre in the UK, and acquired a domestic mechanical engineering services group.
BANNOCKBURN, IL – IPC has released IPC-7095B, Design and Assembly Process Implementation for BGAs.
This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman.
“There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said
The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement.
This revised document focuses on applications that use both SnPb and Pb-free on the same board, including various solder ball alloys, new laminate materials for Pb-free, BGA trace escape and routing considerations during board design to improve yield and reduce cost,” explained Ray Prasad, task group chairman.
“There is also a detailed discussion of reflow solder profiling, void process indicators and ways to improve product reliability,” he said
The standard was approved by consensus last month, said Prasad, who is also principal of Ray Prasad Consultancy Group, in a statement.
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