INDIANAPOLIS – A quartet of researchers has published a new book describing the lifecycles of electronics parts and software, and explaining processes of obsolescence forecasting, and reactive, proactive, and strategic management of obsolescence.
BAKERSFIELD, CA – NuSil Technology said it is planning a large facility and expanded capabilities here.
EDINA, MN -- The SMTA seeks abstracts on a range of topics in surface mount assembly and electronics packaging for the 2013 Pan Pac Symposium.
The abstract deadline is Sept. 7. The event takes place in Maui, Hawaii.
Submit abstracts and view more info at smta.org/panpac/call_for_papers.cfm
CHENGDU -- Foxconn's campus here was reportedly the scene of a massive riot Monday night as as many as 1,000 workers faced off against company security guards.
NEW YORK -- A rebound in demand for telecommunications equipment is increasingly unlikely for 2012, according to a pair of the leading EMS suppliers in that area.
HERNDON, VA -- iNEMI today published a position paper outlining limits of temperature, humidity and gaseous contamination in data centers and telecommunication rooms to avoid creep corrosion on printed circuit boards.