OSAKA, JAPAN — A new guide from Nihon Superior on “Reliability of Lead-Free Solder in Thermal Cycling” is the first in a series on lead-free solder selection.

WARRENDALE, PA -- SAE Aerospace has published new guidelines for prescreening components and conducting on-site assessments of potential suppliers.

HIGH WYCOMBE, BUCKS, UK — Smart Group will host a workshop on handling moisture-sensitive components and PCB handling next month.

BRUSSELS -- The International Trade Commission has launched an an investigation on behalf of Nanya to determine whether imports of certain DRAM devices are infringing patents.