MINNEAPOLIS, MN—SMTA International, co-located with the Assembly Tech Expo (ATExpo) show at the Donald Stephens Convention Center in Rosemont, IL from Sept. 25-29, will feature many events concentrating on lead-free soldering technology and environmental compliance issues.

 Courses will be held on the following lead-free topics:

- Lead-free Manufacturing

- Lead-free Troubleshooting

- Lead-free Wave Soldering Process Troubleshooting

- Lead-free Inspection, Process Control and Defect Elimination

- Lead-free Rework

- Lead-free Reliability

- Lead-free Solder Joint Reliability

- Lead-free Surface Finishes and Compatibility with Lead-free Soldering

- Lead-free System Compatibility - Materials and Processes

- A - Z of Lead-free Soldering Master Class

- DFM: Surface Mount PCB Design Guidelines and Lead-free Assembly Process

Development

- Tin Whiskers: Historical Prospective, Test Method, Mechanisms, Reduction

and Elimination

- RoHS 101 and Lead-free Surface Mount Assembly

Almost 60 technical paper sessions will cover lead-free reflow and wave soldering, rework, key issues in lead-free/RoHS manufacturing, lead-free CSP reliability, HASL surface finishes, effects on PCBs, surface finishes, process control and RoHS test methods and compliance, customer and industry requirements, and due diligence approach to WEEE/RoHS compliance.

In addition, the Lead-free Soldering Symposium will consist of technical sessions organized by the Joint Council on Aging Aircraft / Joint Group on Pollution Prevention

(JCAA/JCPP) Lead-free Solder Consortia Project, as well as sessions on Process for Lead-free Implementation and Lead-free Reliability.  It will provide the latest information on materials selections, lead-free processing techniques, and critical aspects of lead-free interconnection reliability, including backward/forward compatibility, moisture-level effects and failure analysis techniques.

Additional events include two lead-free panel discussions, a half-day workshop on Lead-free Reflow Soldering Using Convection Dominant Ovens, the opening ceremony on RoHS Compliance and Solder Trends and the SMTA Annual Meeting keynote on "The Impact of Temperature on Hybrid and Compliant Assemblies" by Dan Shea, CTO of Celestica. 

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