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MINNEAPOLIS, MN – The Surface Mount Technology Association (SMTA) has announced the technical sessions for its annual conference, SMTA International, co-located with the Assembly Tech Expo show in Rosemont, IL, Sept.25-29.

The 1.5-hour technical sessions each present three technical papers under the direction of a chairman. They are arranged according to tracks on Manufacturing and Assembly, Advanced Packaging, Substrates, RoHS and Process Control, covering topics such as lead-free soldering and rework, HDI, RFID, microdevices, BGA reliability, CSP and flip-chip technologies, selective soldering, lead-free process control, leadless packaging, surface finishes, RoHS compliance, harsh environments and AOI.

The RFID mini-conference has three paper sessions on Production Lines, Tag Materials and Processing, and Applications in the Electronics Manufacturing Industry. Two new sessions will cover RoHS compliance. Technical papers on lead-free will address reflow and wave soldering, rework, key issues in lead-free/RoHS manufacturing, lead-free CSP reliability, HASL surface finishes, effects on PCBs, surface finishes, process control, and

RoHS test methods and compliance, customer and industry requirements, and due diligence approach to WEEE/RoHS compliance.

Organized by Dr. Paul T. Vianco of Sandia National Labs, the Lead-Free Soldering Symposium will consist of technical sessions organized by the Joint Council on Aging Aircraft / Joint Group on Pollution Prevention Lead-free Solder Consortia Project, as well as sessions on Process for Lead-free Implementation and Lead-free Reliability. 

The Contract Manufacturing Symposium, organized by Mike Buetow, UP Media Group/Circuits Assembly, will feature paper sessions on Mid-Tier

EMS Strategy and Models and Markets. 

Led by Dr. Reza Ghaffarian, Jet Propulsion Labs, the Emerging Technologies Summit will feature papers on Roadmaps, Turning Lead Into Gold and Advanced Power Technology.

For more info: smta.org/smtai

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