BANNOCKBURN, IL -- Just months before the RoHS compliance deadline, IPC and JEDEC are seeking papers for their International Conference on Lead-Free Electronic Components and Assemblies. The conference will be held March 6-8, 2006, in Santa Clara, CA.
 
Papers from environmental managers and technical staff are sought on any relevant subjects, including:
Policy development policy - European lead ban status
European/Chinese/other legislation or voluntary activity on hazardous materials and recycling
Legislative compliance and policy enforcement methods
 
Supply chain issues
Standards for marking and testing
Materials declarations, part numbers, obsolescence, etc.
 
Production issues
Design for lead-free production
Components, solder, board developments, availability and lead-free compatibility
Examples of implementation
Reflow, wave, hand soldering, inspection, repair, rework and test, etc.
 
Reliability issues
Tin whiskers
High reliability product sectors (automotive, aerospace, etc.)
Reliability test data and method developments
 
Environmental considerations
Toxicity and risk
Recycling
Hazardous substance substitutes
Research consortia news and updates
 
Submit a 200-300 word abstract, along with a brief biography, to LFConf@ipc.org by Dec.6.

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