FRANKLIN, MA -- Speedline Technologies will tackle the SMT industry's most pressing manufacturing challenges in a new series of free, monthly webinars.

Designed for OEM and CEM process engineers, each of the monthly 60-minute Internet-based seminars will focus on challenges specific to a major surface mount manufacturing process.

Speedline staff will host the online workshops. The webinars will include an educational presentation, discussion of new technologies and techniques, practical how-to advice and a Q&A opportunity.

The 2006 schedule is:

Jan. 19 -- Lead-Free Printing Process
Feb. 16 -- 0201 and 01005 Component Assembly Process
March 16 -- Lead-Free Reflow Soldering
April 13 -- Adhesive Printing
May 18 -- Pin in Paste (Intrusive Reflow)
June 15 -- Lead-Free Wave Soldering
July 13 -- Challenges of High Speed Underfill
Aug. 17 -- Lead-Free Printing Process
Sept. 14 -- Practical DOE and SPC for Electronics Assembly
Oct. 19 -- Cleaning Lead-Free Residues
Nov. 16 -- MicroDot Dispensing
Dec. 14 -- 0201 and 01005 Component Assembly Process

All Webcasts are free and will begin at 11 am., U.S. Eastern time.

For more information or to register, go to http://www.speedlinetech.com/seminars or call 508-541-4749.

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