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Clinton, NY -- Dr. Ning-Cheng Lee, vice president of technology at Indium Corp., will receive the 2006 Exceptional Technical Achievement Award from the IEEE Components, Packaging and Manufacturing Technology (CPMT) Society. Dr. Lee was selected for his contributions to surface-mount technology and electronics packaging assembly. 
This annual award recognizes contributions to new and important technology or products that advance the fields encompassed by the CPMT Society. The award presentation will take place on June 1, as part of the Electronics Components and Technology Conference (ECTC) in San Diego.
 
Dr. Lee was named SMTA Member of Distinction in 2002 and received the Soldertec Global Lead-Free Solder Award in 2003. He is also an SMTA board member, liaison to the Taiwan SMTA chapter, coordinator and chair of the 2005 Nepcon Shanghai technical program, and author of two books and over 100 technical papers.
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