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Isola Group, SARL has successfully tested IS620 under simulated lead-free assembly conditions. The boards, built at Merix, went through the reflow assembly simulation six times without any delamination. The peak temperatures were over 262°C. The 14-layer capability board was tested before and after eight reflow simulations and the results did not show any thermal degradation, the T-26's were over 60 min. and the decomposition temperatures and the T-288s were also unchanged.

"We are really pleased with the results, IS620 is rapidly gaining momentum as the low-loss product of choice for very high speed applications due to excellent thermal cycling and low loss attributes," said Tarun Amla, VP and CTO.

"The Merix lead free testing program is aggressive and materials that successfully pass are robust. These results are very encouraging..." said Doug Trobough, CTO of Merix.

The epoxy is currently manufactured in the Isola high performance and quick turn facility in Fremont, CA.

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