Circuits Assembly Online Magazine - Henkel Macromelt Moulding Solution Streamlines Manufacture

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Macromelt is a low-pressure moulding solution for packaging of vehicle sensors. By replacing conventional sensor enclosures that require potting, it reduces the complexity, time and cost to assemble the large number of sensors required by modern vehicles.

Simultaneously encapsulates the sensor's circuitry and forms the outer shell of the component to enable a self-contained and highly integrated component. The composition of the moulding material, a polyamide hotmelt, is available in a variety of formulations.

Compatible with a range of vehicle sensors and highly miniaturised door-handle electronics as well as new technologies such as intelligent battery sensors and screen-mounted antennas with integral cable stress relief. Pre-moulded connectors and sealed units plus grommets and strain relief components can also be manufactured.

Available in translucent amber or black, standard, with a variety of colors available to special order. Resistant to fluids commonly found in automotive environment such as antifreeze, petrol or diesel and hydraulic fluid. Can operate from -40 to +150 ºC.

Henkel, www.electronics.henkel.com