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Ashburn, VA - Sanmina SCI recently replaced IPA in their existing underside cleaning process with Zestron SW.  The switch was prompted by the New Product Introduction Center to reduce the number of solder balls per board to comply with the IPC-610 standard. Various process optimizations with IPA failed which led to the search for a new cleaning agent. Process advantages achieved with the switch include the prevention of solder balls on the boards, a reduction in the consumption of the cleaner, a shorter process time and a higher flash point which led to increased operational safety.
 
Zestron, zestron.com

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